Dan’s Biz Bookshelf: 'This Is Strategy: Make Better Plans'
The Chemical Connection: Reducing Defects in Circuit Board Production
It’s Only Common Sense: Trust Is All You Need
Global SiC Substrate Revenue Declines 9% in 2024; Long-Term Demand Remains Strong as 8-Inch Roadmap Gains Momentum
May 12, 2025 | TrendForceEstimated reading time: 1 minute
TrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024. At the same time, intensifying market competition and sharp price declines have pushed global revenue for N-type SiC substrates down 9% YoY to US$1.04 billion.
Looking ahead to 2025, the SiC substrate market will continue to face dual pressures of soft demand and oversupply. However, long-term growth prospects remain promising. As production costs gradually decline and semiconductor device technology advances, SiC applications are expected to expand—particularly in diverse industrial segments. Moreover, heightened competition is accelerating industry consolidation and reshaping the market landscape.
Four major players control 82% market share; Wolfspeed remains the leader
Wolfspeed maintained its position as the top supplier in 2024 with a 33.7% market share, despite ongoing operational challenges. The company remains a key force in the SiC materials market and continues to lead the industry’s transition to 8-inch wafers
Chinese vendors TanKeBlue and SICC have rapidly emerged as major players, claiming 17.3% and 17.1% market shares respectively, placing them in second and third place. TanKeBlue is the largest domestic SiC substrate supplier for China’s power electronics market, while SICC leads in the 8-inch SiC wafer segment. Coherent, by contrast, dropped to fourth place with a share of 13.9%.
Although 6-inch SiC substrates will remain dominant in the near term—due to their steep price declines and the technical challenges of scaling 8-inch front-end processes—8-inch wafers are seen as essential for further cost reduction and advancing chip performance. This is driving aggressive investment across the industry.
TrendForce forecasts that 8-inch SiC substrates will account for over 20% of total shipments by 2030, signaling a pivotal shift in the technology roadmap.
Share on:
Suggested Items
Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs
05/15/2025 | TrendForceTrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.
SIA Welcomes Legislation to Strengthen U.S. Semiconductor Manufacturing Credit
05/02/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming House introduction of Building Advanced Semiconductors Investment Credit (BASIC) Act.
Cyient Announces the Launch of Semiconductor Subsidiary
04/08/2025 | PRNewswireCyient, a leading global engineering and technology solutions company, announced the launch of its fully owned semiconductor subsidiary, Cyient Semiconductors.
NVIDIA Omniverse Physical AI Operating System Expands to More Industries and Partners
03/19/2025 | Global NewswireNVIDIA unveiled that leading industrial software and service providers Ansys, Databricks, Dematic, Omron, SAP, Schneider Electric with ETAP, Siemens and more are integrating the NVIDIA Omniverse™ platform into their solutions to accelerate industrial digitalization with physical AI.
PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025
03/17/2025 | I-Connect007 Editorial TeamIn the March 2025 issue of PCB007 Magazine, we go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore.