Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
May 6, 2025 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas. Now in its 75th year, ECTC is the premier international event dedicated to microelectronic packaging, components, and systems, bringing together global experts for collaboration, education, and innovation.
As the exclusive sponsor of the ECTC Gala, Koh Young is proud to continue its commitment to the advanced packaging community. The 2025 technical program features groundbreaking work in assembly and manufacturing technologies, heterogeneous integration, wafer-level packaging, and semiconductor inspection. Attendees will gain insights from industry leaders through technical sessions, panels, plenaries, and EPS seminars, as well as in the exhibition area.
The ECTC Exhibition offers a vital opportunity for engineers, technologists, and decision makers to engage directly with Koh Young and other technology leaders. Visit booth 419 to learn how our AI-powered 3D inspection solutions are solving critical challenges in advanced packaging and semiconductor applications. Our experts will be on hand to discuss how True 3D measurement and automated process control are helping manufacturers improve quality, reduce waste, and achieve zero-defect production goals.
“As advanced packaging and semiconductor technologies continue to push the limits of precision and reliability, manufacturers need inspection solutions that can keep pace,” said Brent Fischthal, Head of Global Marketing at Koh Young. “At ECTC 2025, we’re excited to connect with engineers and decision makers to explore how our AI-powered 3D metrology solutions enable smarter process control and higher yield. We're also pleased to introduce our new sales partner, NTV USA, who will help us expand support for customers in these critical application areas.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
07/23/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
DuPont Publishes 2025 Sustainability Report
07/22/2025 | PRNewswireDuPont published its 2025 Sustainability Report detailing the progress made toward achieving its 2030 Sustainability Goals.
NEOTech’s Westborough Facility Achieves AS9100 Surveillance Audit, Reinforcing Trust with Aerospace & Defense Customers
07/22/2025 | NEOTechNEOTech, a premier provider of electronic manufacturing services (EMS), integrated design engineering, and advanced supply chain solutions for the aerospace and defense, medical device, and high-tech industrial markets, proudly announces that its Westborough, Massachusetts facility has successfully completed the rigorous AS9100 Bi-Annual Surveillance Audit with zero findings, a testament to the company’s unwavering commitment to quality, security, and operational excellence.
PCBAA Wins Summit Silver Award from the American Society of Association Executives
07/18/2025 | PCBAAPCBAA was one of 38 associations that earned Silver Awards for outstanding contributions for an entry titled: Chips Don’t Float: More Printed Circuit Boards Must be Made in America.
INSPECTIS AB ‘Makes it a Meal’ with Series U50s Advanced Kit
07/18/2025 | INSPECTIS ABFamous chefs the world over maintain that an entrée doesn’t make a great meal without side dishes. At INSPECTIS, we call those ‘sides’ an Advanced Kit.