Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
May 5, 2025 | SEMIEstimated reading time: 1 minute
SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2025 will gather industry experts and innovators to explore how international collaboration is driving technological innovation, economic resilience, and sustainability across Europe’s semiconductor ecosystem. The exhibition and conference will be co-located with productronica.
Call for Abstracts
Advanced Packaging Conference (APC) ─ Key Enabler for System Performance
Advanced packaging technologies—including 2.5D and 3D stacking, chiplet integration, and heterogeneous packaging—are revolutionizing system performance by delivering greater processing power and energy efficiency. Innovations in advanced materials and interconnects are further reducing signal loss and latency, enabling high-performance computing and AI at scale. Abstracts are invited on key topics including advanced materials and processes for packaging, power and thermal management in 2.5D/3D packaging, packaging innovations for silicon photonics, and testing inspection and metrology.
MEMS & Imaging Sensors Summit ─ Industry Meets Innovative Ideas
Entrepreneurs, startups, graduates, and newcomers will showcase their research and early-stage products. Topics of interest include new applications and use cases for MEMS and sensors, advancements in technology and materials, smart MEMS and AI integration, MEMS-photonics co-integration, alternative imaging sensor architectures, and foundry offers for start-ups.
Pre-recorded Innovation Presentations ─ Global Collaborations for European Economic Resilience
SEMI Europe will also highlight microelectronics and semiconductors innovations in short pre-recorded messages, pitches and product announcements that will be aired on SEMICON Europa 2025 main stages during networking sessions and on the final day of the exhibition. Projects of interest include sustainability and green technologies, diversity and inclusion, semiconductor advancements in aerospace, defense and automotive applications, as well as smart manufacturing, cybersecurity and more.
Presentation abstracts, biographies, and headshots must be submitted in English through the SEMICON Europa 2025 Call for Abstracts portal by Friday, June 20, 2025. Selected presenters will be notified in August 2025.
Share on:
Suggested Items
PCBAA Wins Summit Silver Award from the American Society of Association Executives
07/18/2025 | PCBAAPCBAA was one of 38 associations that earned Silver Awards for outstanding contributions for an entry titled: Chips Don’t Float: More Printed Circuit Boards Must be Made in America.
INSPECTIS AB ‘Makes it a Meal’ with Series U50s Advanced Kit
07/18/2025 | INSPECTIS ABFamous chefs the world over maintain that an entrée doesn’t make a great meal without side dishes. At INSPECTIS, we call those ‘sides’ an Advanced Kit.
July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.