It’s Only Common Sense: The Power of Storytelling in Sales
Dan’s Biz Bookshelf: 'This Is Strategy: Make Better Plans'
The Chemical Connection: Reducing Defects in Circuit Board Production
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
May 2, 2025 | iNEMIEstimated reading time: 1 minute
In semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield. Traditional supervised machine learning approaches struggle with data sparsity, imbalance, and the need for extensive labeled datasets, particularly during new product introduction (NPI).
To address these challenges, this webinar introduces an explainable AI framework that integrates deep topological data analysis (DTDA) and self-supervised learning (SSL). DTDA, an unsupervised machine learning method, transforms complex datasets into two-dimensional networks, where nodes represent clusters of similar samples, enabling identification of key features impacting yield and quality and providing actionable insights for corrective measures. SSL complements this by leveraging large amounts of unlabeled data to detect patterns and anomalies without explicit supervision.
Transfer learning further enhances capabilities, enabling rapid adaptation to new datasets while reducing computational overhead. By automating clustering and grouping, it enhances process monitoring, defect identification, and decision-making, ultimately improving yield and reducing costs.
This framework holds potential for broader applications beyond semiconductor manufacturing, especially in industrial settings requiring analysis and extraction of insights from large-scale, high-dimensional datasets.
About the Speaker Janhavi Giri, PhD
Intel Corporation
Dr. Giri is a data scientist with more than a decade of experience in the semiconductor industry. She specializes in applying advanced machine learning techniques, including topological data analysis (TDA) and causal AI, to solve high-dimensional data challenges in semiconductor manufacturing. Her expertise focuses on yield optimization, equipment productivity, root cause analysis, and high-dimensional data mining. Dr. Giri holds advanced degrees in Physics and Applied Mathematics and is passionate about bridging AI innovations with manufacturing to drive smarter, more efficient solutions.
Future of Electronics Series
This webinar is the first in a year-long series on the intersection of smart manufacturing, sustainability and systems integration. Watch the INEMI calendar for additional webinars in this series.
Registration
This webinar is open to industry; advance registration is required.
Tuesday, May 6, 2025
11:00 a.m. – 12:00 p.m. EDT (North America)
5:00-6:00 p.m. CEST (Europe)
Get additional details and register for this webinar
Share on:
Suggested Items
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation—Smart Homes
06/03/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.
Global Smart Manufacturing Market Size to Reach $787.54 Billion by 2030
06/02/2025 | PRNewswireThe global Smart Manufacturing Market Size is projected to be valued at USD 297.20 billion in 2023 and reach $787.54 billion by 2030, growing at a CAGR of 14.9% according to a new report by The Research Insights.
IBM Officially Closes Deal, Acquiring DataStax
05/30/2025 | I-Connect007On May 28, DataStax announced that its acquisition by IBM had officially closed. The open-source database company based in Santa Clarita, California, announced the deal earlier this year, as part of its vision to accelerate AI production and NoSQL data at scale.