-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
April 24, 2025 | LITEON TechnologyEstimated reading time: 1 minute
LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Building upon their initial collaboration in 2023, which focused on developing low-carbon Flexible Printed Circuits (FPC) technology for commercial applications, this new agreement expands the scope to include equipment investment with integration into existing production lines in cooperative factories. The adoption of Elephantech’s proprietary technology will help inject new momentum into building a more sustainable supply chain.
Roger Chen, Director of LITEON+, the company's startup platform, stated: "The signing of our second MoU marks a new milestone in our partnership with Elephantech. We're moving beyond early-stage product applications in equipment investment. Through this advancement, we will be able to embed sustainability deeper into our operations and continue leading the industry in building sustainable competitiveness."
Since its establishment in 2023, LITEON+ has been dedicated to nurturing promising global startups that share a vision for sustainability. The platform provides resources, technology and accesses to international market expansion. Elephantech, as one of LITEON+'s first strategic partners, has been instrumental in developing innovative applications for low-carbon PCB technology.
Elephantech's agile startup model has rapidly accelerated new technology implementation. In just six months, both companies have successfully validated the feasibility of applying Elephantech’s technology to multilayer PCBs. Under this new MoU, LITEON plans to invest in Elephantech's proprietary PCB manufacturing equipment and implement it into existing cooperative factories to comprehensively upgrade production lines. This collaboration will help to reduce the carbon footprint of consumer electronics production, cut water and copper consumption, minimize environmental impact—ultimately enhancing sustainability throughout the supply chain and setting a new benchmark for green manufacturing.
Suggested Items
COMPUTEX 2025 Concludes Successfully AI Deployment Accelerates as Taiwan Solidifies Its Strategic Global Position
05/23/2025 | PRNewswireCOMPUTEX 2025 concluded today after four days of dynamic exhibitions and events. The show welcomed an impressive turnout, with 86,521 buyers from 152 countries, including Japan, the United States, South Korea, Vietnam, and India.
Imec Joins Forces with MIT’s RLE, MTL and IMES to Accelerate Personalized Healthcare
05/23/2025 | ImecImec, a leading research and innovation hub in nanoelectronics and digital technologies announced their collaboration with Massachusetts Institute of Technology (MIT), a renowned research university in advanced technology and science to research nanoelectronics-based solutions for minimally and non-invasive diagnostic devices for personalized medicine.
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
05/22/2025 | GlobalFoundriesGlobalFoundries (GF) announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.
Incap Helps Develop Future Talent in Robotics and Engineering in Finland
05/21/2025 | IncapIncap Corporation continues to invest in the next generation of technology professionals in Finland through its involvement in two national initiatives focused on technical and vocational education.
Jabil, AVL Collaborate on Design and Manufacturing Solutions for Automotive and Transportation Customers
05/21/2025 | BUSINESS WIREJabil Inc., a global manufacturing solutions provider to market-leading automakers, announced it has signed a memorandum of understanding (MOU) with AVL Software and Functions GmbH, the e-drive and software center of AVL List GmbH.