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Advanced Electronics Packaging Digest

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Suggested Items

Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

07/20/2026 | Tower Semiconductor
Tower Semiconductor, a leading foundry of high-value analog semiconductor solutions, announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan.

Smartphone Shipments Fall 6.7% in Q2 2026 Amid Memory Crisis

07/14/2026 | IDC
The global smartphone market shrank 6.7% year-on-year to 277.5 million units in the second quarter of 2026 (2Q26), according to the preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.

NATO Signals Intent to Expand Maritime ISR Capability with Northrop Grumman's MQ-4C Triton

07/10/2026 | Northrop Grumman
NATO has signed a Letter of Intent (LOI) to expand its Intelligence, Surveillance, and Reconnaissance (ISR) Force by pursuing acquisition of Northrop Grumman’s MQ-4C Triton aircraft. This action signals NATO's commitment to enhance allied maritime security and situational awareness.

Mycronic Lands $5-7M SLX Mask Writer Order from Asian Customer

06/30/2026 | Mycronic
Mycronic AB has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of $5-7 million. Delivery of the system is planned for the third quarter of 2026.

Q/C Technologies Relocates HQ to San Francisco for Photonic Computing Push

06/30/2026 | Globe Newswire
Q/C Technologies, Inc. announced that it has relocated its headquarters to San Francisco, California, as part of its plan to develop a proprietary optical processing unit (OPU) capable of overcoming the heightened performance and energy constraints of today’s artificial intelligence inference infrastructure.
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