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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

IPC Standards Released for Q2 2026

08/14/2026 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q2 2026.

I-Connect007 Welcomes New Columnists from Flexible Circuit Technologies

08/12/2026 | I-Connect007
In an exciting new column for I-Connect007 Magazine, a team of application engineers from Flexible Circuit Technologies will draw on decades of experience designing and manufacturing flex and rigid-flex circuits to offer practical guidance to help PCB designers make better engineering decisions. Mark Finstad, Chris Clark, Terrill Schmidt, Dan Skweres, and Zack Schaner will rotate authoring the new column, called Flex Connections, which begins in the August issue, with Dan drawing on his many years of experience to explain why just because you can do something in PCB design, doesn’t mean you should.

Smart Textile Integration with Flex PCBs

08/10/2026 | Anaya Vardya, American Standard Circuits
The idea of clothing that monitors your health sounds like science fiction. It is not. Flex PCBs, integrated with conductive yarns and polymer substrates, are turning ordinary fabric into diagnostic platforms and turning your shirt into a medical device. The implications for healthcare, athletics, and workplace safety are profound. The fundamental engineering challenge of wearable electronics has always been the interface between two incompatible worlds: the rigid, planar world of conventional electronics and the soft, stretchy, washable world of textiles. Early smart garments solved this by simply attaching a rigid sensor pod to clothing, which was functional but bulky and uncomfortable. Flex PCBs collapse that boundary.

Flexible Circuit Technologies (FCT) Welcomes Mark Duarte as Director of Global Business Development

08/05/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies Inc.(FCT) a flexible, printed circuit, and advanced electronics manufacturer, is pleased to announce that Mark Duarte has joined the company as Director of Global Business Development, Printed Electronics. 
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