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The Shaughnessy Report: Solving the Data Package Puzzle

05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy Report
If you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.

Material Selection and RF Design

04/21/2025 | Andy Shaughnessy, Design007 Magazine
Innovation rarely sleeps in this industry, and the RF laminate segment offers a perfect example. RF materials have continued to evolve, providing PCB designers much more than an either/or choice. I asked materials expert Alun Morgan, technology ambassador for the Ventec International Group, to walk us through the available RF material sets and how smart material selection can ease the burden on RF designers and design engineers.

EDA Tools and RF Design Techniques

04/14/2025 | Andy Shaughnessy, Design007 Magazine
High-speed PCB design is complex enough, but RF design can be a whole new ball game. RF designers have to contend with tuning and other ideas that traditional PCB designers don’t have to worry about, as well as crosstalk, parasitic capacitance, and material limitations. Most PCB design tool companies now offer RF design options, so designers no longer have to use pureplay RF design tools for anything but the most cutting-edge designs. Cadence Design Systems expanded its RF EDA offerings by acquiring the RF software company AWR a few years ago. We asked David Vye, product management director at Cadence, to share his thoughts on EDA software, RF design, and what new RF designers and engineers need to understand.

The Key to First-pass Success in PCB Design

04/10/2025 | Gerry Partida, Summit Interconnect
In the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.

Target Condition: Designing vs. Inventing

03/27/2025 | Kelly Dack -- Column: Target Condition
After hearing me rave about IPC APEX EXPO for years, my boss, Chad Orebaugh, joined me at the show for the first time last year. We met at the registration counter, got our badges, and he said, “Okay, Kelly, impress me.”
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