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Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics

04/02/2025 | Teradyne
Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics.

TRI Test Solutions at INNOELECTRO 2025

04/02/2025 | TRI
Anytest will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase TRI's Test Solution.

Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION

04/01/2025 | Yamaha Robotics SMT Section
Yamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.

Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage

03/31/2025 | Real Time with...IPC APEX EXPO
Neil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.

TTCI and TTC-LLC to Exhibit and Sponsor at SMTA Tech & Expo Forums in Dallas and Houston

03/27/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) are proud to announce their participation as exhibitors and sponsors at the upcoming Dallas SMTA Tech & Expo Forum on April 1, 2025.
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