American Made Advocacy: America, It’s Time to Reclaim Manufacturing Leadership
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
Indium to Showcase Innovative Materials Powering AI Technology at Productronica China
March 25, 2025 | Indium CorporationEstimated reading time: 1 minute
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Indium Corporation’s GalliTHERM® portfolio of gallium-based liquid metal solutions builds on more than 60 years of expertise in manufacturing advanced gallium-based materials. Designed for both TIM¹ and TIM² applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability. Liquid metal TIMs offer:
- High thermal conductivity versus polymers
- High purity enables excellent wetting to surfaces
- No soldering or surface metallization needed
Indium Corporation’s Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices. Indium has a high bulk thermal conductivity (86 W/m-K) which means less sensitivity to bond line thicknesses and coplanarity issues compared to polymeric TIMs. Indium’s ductility can accommodate differential thermal expansion with minimal stress on the interface making Solder TIM an ideal TIM1 or TIM1.5 where die or substrate warpage and CTE mismatch challenges are present.
Indium Corporation’s Heat-Spring® solutions provide an optimal TIM2 solution as a compressible, non-reflow metal TIM. In liquid immersion systems, Heat-Spring® is also a proven TIM compatible with all major immersion fluids that will not dissolve in Single–Phase or Two-Phase immersion cooling liquids. These indium-based TIMs deliver outstanding thermal conductivity compared to non-metal alternatives—with pure indium metal achieving 86 W/m·K in all directions. Due to its solid metal state, Heat-Spring® effectively prevents pump-out and bake-out issues while also supporting sustainability through Indium Corporation’s reclaim and recycle program.
Share on:
Suggested Items
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/23/2025 | I-Connect007I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial TeamGoogle announced that it has entered Taiwan’s first corporate geothermal power purchase agreement (PPA) with Baseload Capital to expand access to around-the-clock clean energy in the Asia-Pacific region and beyond.
Laird Thermal Systems Announces Max Kley as New CEO
04/18/2025 | Laird Thermal SystemsLaird Thermal Systems (LTS) is pleased to announce the appointment of Dr. Max Kley as its new Chief Executive Officer, effective April 1, 2025. Max Kley brings a wealth of international leadership experience to LTS, having successfully led and developed businesses across the USA, Europe, and Asia.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.