-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
CommScope, Altice Labs Combine PON Technologies to Power Next-Gen FTTH Networks
March 21, 2025 | BUSINESS WIREEstimated reading time: 1 minute
CommScope, a global leader in network connectivity, announced the availability of its PON Evo™ products, a comprehensive suite of passive optical network (PON) active optical line terminal (OLT) solutions. The PON Evo suite is the result of a strategic partnership with Altice Labs, a leading R&D company, specializing in advanced telecommunications solutions.
CommScope’s PON Evo suite of products and vBNG Evo™ solution support a comprehensive, managed and orchestrated network transition strategy under a unified architecture. CommScope is integrating the Altice Labs line of advanced OLTs, software-defined network (SDN) management, and operational and business support systems into its existing portfolio.
As average revenue per user (ARPU) continues to decline, these benefits can facilitate migration from GPON to XGS-PON, and even 50G PON, all on the same infrastructure, with the integration of Altice Labs’ dual density XGS-PON SFP and dual XGS-PON SFP+ solutions, which significantly increases PON port density.
“By combining our existing virtual broadband network gateway (vBNG) and remote OLT solutions with Altice Labs’ technologies, we are now positioned to deliver a comprehensive and competitive FTTH portfolio giving our customers a single-source partner,” stated Guy Sucharczuk, SVP and president, Access Network Solutions, CommScope. “This expanded ecosystem is designed to meet the evolving needs of our customers as they deploy next-generation FTTH networks. These innovative PON solutions also expand upon our portfolio of hybrid fiber coax (HFC) solutions for customers who are implementing targeted FTTH deployments.”
“CommScope’s vBNG Evo solution is an excellent complement to our xPON technology,” said Joao Paulo Firmeza, general manager of Altice Labs. “This is a great mutually relevant collaboration whereby our offering is expanded with CommScope technologies, and they can now offer a full PON portfolio with the addition of Altice Labs’ technology. Together we create a formidable partnership aligned to meet our customers’ needs.”
Suggested Items
Mazda, ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
03/28/2025 | ROHMMazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.
DuPont Earns Silver Medal from EcoVadis for Sustainability Performance
03/28/2025 | PRNewswireDuPont announced it has received the Silver Medal from EcoVadis, a global leader in sustainability assessments, in recognition of the company's continued advancement and progress on its sustainability performance.
DuPont Announces Board of Directors for the Planned Independent Electronics Company
03/27/2025 | PRNewswireDuPont announced the members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix™ Platform
03/27/2025 | PRNewswireAnsys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.