Schmoll: Decades of Technology Evolution
It’s Only Common Sense: The Danger of Overthinking
Punching Out: Fewer Than 150 PCB Shops Remain in North America
CommScope, Altice Labs Combine PON Technologies to Power Next-Gen FTTH Networks
March 21, 2025 | BUSINESS WIREEstimated reading time: 1 minute
CommScope, a global leader in network connectivity, announced the availability of its PON Evo™ products, a comprehensive suite of passive optical network (PON) active optical line terminal (OLT) solutions. The PON Evo suite is the result of a strategic partnership with Altice Labs, a leading R&D company, specializing in advanced telecommunications solutions.
CommScope’s PON Evo suite of products and vBNG Evo™ solution support a comprehensive, managed and orchestrated network transition strategy under a unified architecture. CommScope is integrating the Altice Labs line of advanced OLTs, software-defined network (SDN) management, and operational and business support systems into its existing portfolio.
As average revenue per user (ARPU) continues to decline, these benefits can facilitate migration from GPON to XGS-PON, and even 50G PON, all on the same infrastructure, with the integration of Altice Labs’ dual density XGS-PON SFP and dual XGS-PON SFP+ solutions, which significantly increases PON port density.
“By combining our existing virtual broadband network gateway (vBNG) and remote OLT solutions with Altice Labs’ technologies, we are now positioned to deliver a comprehensive and competitive FTTH portfolio giving our customers a single-source partner,” stated Guy Sucharczuk, SVP and president, Access Network Solutions, CommScope. “This expanded ecosystem is designed to meet the evolving needs of our customers as they deploy next-generation FTTH networks. These innovative PON solutions also expand upon our portfolio of hybrid fiber coax (HFC) solutions for customers who are implementing targeted FTTH deployments.”
“CommScope’s vBNG Evo solution is an excellent complement to our xPON technology,” said Joao Paulo Firmeza, general manager of Altice Labs. “This is a great mutually relevant collaboration whereby our offering is expanded with CommScope technologies, and they can now offer a full PON portfolio with the addition of Altice Labs’ technology. Together we create a formidable partnership aligned to meet our customers’ needs.”
Share on:
Suggested Items
American Made Advocacy: Reshoring—About Trust, Not Just Geography
03/25/2025 | Shane Whiteside -- Column: American Made AdvocacyIn today’s chaotic political environment, you might have missed the fact that Congress allocated nearly $3 billion to rip out and replace key components in America’s telecommunications networks. The funding is to remove equipment from networks nationwide because of cyberattacks on internet routers and cellular networks enabled by a Chinese company that makes more than half of the routers sold in the U.S. We know from prior experience and similar transgressions that we cannot trust that Chinese components aren’t being used for nefarious purposes.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.
Just Because You Can, Doesn’t Mean You Should
03/20/2025 | Tony Plemel, Flexible Circuit TechnologiesDecisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.
Gold as a Key Component in PCBs and IC Substrates
03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' AtotechGold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.
DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI
03/19/2025 | DuPontDuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.