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Advanced Electronics Packaging Digest

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PacSci EMC Announces Production Expansion to Manufacturing Facility in Solon, Ohio

06/30/2026 | BUSINESS WIRE
Pacific Scientific Energetic Materials Company announced the expansion of its production capabilities to a manufacturing site in Solon, Ohio.

Matric Group First US Manufacturer to Deploy Panasonic NPM-GH SMT Tech

06/30/2026 | EINPresswire.com
Matric Group has made a major investment in advanced dual-lane surface-mount technology (SMT) manufacturing at its Seneca, Pennsylvania headquarters, expanding domestic capacity for high-reliability, high-mix electronics production.

Scanfil Supports TOMRA’s Roll-out in Poland Following Deposit Return System Launch

06/30/2026 | Scanfil
Scanfil has played an important role in supporting TOMRA’s production ramp-up and machine roll-out for Poland’s Deposit Return System (DRS).

AI Chip Shortage, Foundry Cuts to Extend Mature-Node Price Hikes in 2027

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TrendForce’s latest research reveals that rising demand for AI servers, general-purpose servers, and edge AI devices is prompting foundries to dedicate an increasing share of wafer capacity to AI-related products.

Connect the Dots: PCB Manufacturing Focused on Value

06/29/2026 | Matt Stevenson -- Column: Connect the Dots
PCB manufacturing has become more complex, not only to meet the growing need for more advanced, smaller boards, but also to address supply chain disruptions and uncertainty about the cost of critical raw materials. This environment makes it harder for our customers, too. Relatively straightforward decisions about choosing a PCB manufacturer have become more challenging.
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