-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Flex Expands U.S. Manufacturing Capacity to Meet Customers' Growing AI-Driven Power Demands with New Dallas Facility
February 28, 2025 | FlexEstimated reading time: 1 minute
Flex announced the expansion of its U.S. manufacturing capacity with a new 400,000-square-foot Dallas manufacturing facility focused on power products. Flex's Dallas location significantly boosts production capacity and efficiency for its grid-to-chip data center power infrastructure solutions, including power pods, power distribution units, and low-voltage switchgear. This strategic investment enhances Flex's ability to meet the rising power infrastructure demands driven by AI adoption and reduces production lead times for U.S. customers.
New 400,000-square-foot Dallas manufacturing facility will serve as a hub for Flex's growing customer base.
Flex continues to invest in its capabilities to serve the data center market. Following the acquisition of Crown Technical Systems in October 2024, the new Dallas facility will serve as a central hub, bringing together technical power pod fabrication and assembly with utility-grade capabilities in the U.S., enabling faster and more efficient distribution for its growing North American customer base. Flex has a proven track record of scaling power pod production in EMEA and is leveraging that expertise for its U.S. expansion.
"As AI adoption accelerates, the need for reliable, efficient, and scalable power infrastructure grows," said Chris Butler, President of Embedded and Critical Power at Flex. "Our new Dallas facility positions us to deliver next-generation power infrastructure solutions that help customers maximize computing performance while reducing deployment times. We are committed to tackling the complex power challenges of AI-enabled data centers."
As part of Flex's continued U.S. growth plan, this expansion reinforces the company's dedication to scaling production to meet the increasing domestic demand for power solutions.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
SINBON Electronics, Nexcellent Energy Partner on Urban Hydrogen Energy
05/13/2026 | PRNewswire"We have always believed in working with partners who share the same vision," said Alex Shiung, Business Development Assistant Vice President at SINBON. "Together, we hope to build an ecosystem that is friendly to the environment and beneficial for the planet."
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
Casimir Launches With $12M Seed Round for Quantum Energy Chip
05/12/2026 | BUSINESS WIRECasimir, Inc., a quantum energy technology company founded by former NASA advanced propulsion researcher Dr. Harold “Sonny” White, today announced the close of a $12 million seed round led by Scout Ventures.
Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
05/11/2026 | Cadence Design SystemsCadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications.