It’s Only Common Sense: Customers Capabilities—and Confidence
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
eInfochips Joins Samsung Advanced Foundry Ecosystem (SAFE™) to Drive Semiconductor Innovation
February 28, 2025 | PRNewswireEstimated reading time: Less than a minute
eInfochips, an Arrow Electronics company, announced the company has joined the Samsung Advanced Foundry Ecosystem (SAFE™) as a Virtual Design Partner.
Samsung Foundry's Virtual Design Partners offer customers a wide breadth of design services from spec to GDSII. By leveraging these capabilities, customers can easily adopt Samsung Foundry's technologies to develop custom silicon and bring advanced semiconductor solutions to market faster and more effectively.
"We are thrilled to join the Samsung Advanced Foundry Ecosystem," said Mangesh Kulkarni, vice president and general manager of semiconductor practice at eInfochips. "It reflects our deep expertise and positions us to offer an expanded range of design and testing services, utilizing Samsung's latest process technologies. eInfochips brings extensive silicon design experience and a track record of successful tape-outs across 180nm to 3nm process technologies to this ecosystem."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
FlashPCB Names Matthew Belknap Production Manager as Operations Continue to Ramp
04/21/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has promoted Matthew Belknap to Production Manager, following his recent start with the company earlier this year.
FlashPCB Welcomes Adam Broeckert, EIT as Manufacturing Engineer
04/20/2026 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, is pleased to announce the addition of Adam Broeckert, EIT, as Manufacturing Engineer.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
DARPA Launches HARQ Program to Integrate Diverse Qubits for Scalable Quantum Computing
04/20/2026 | DARPADARPA has launched the Heterogeneous Architectures for Quantum (HARQ) program, an effort aimed at overcoming one of the most persistent barriers in quantum computing: how to move beyond single-technology systems to achieve and scale practical, high-impact applications.