-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Global Smartphone Panel Shipments to Grow 11.4% in 2024, with Chinese Manufacturers’ Market Share Approaching 70%
February 26, 2025 | TrendForceEstimated reading time: 2 minutes

TrendForce’s latest findings reveal that global smartphone panel shipments reached 2.157 billion units in 2024, marking an 11.4% YoY increase—the highest in recent years. This growth is driven by rising sales of new smartphone models, alongside increasing demand for second-hand and refurbished devices.
However, in 2025, as demand for new phones stabilizes and the second-hand market plateaus or slightly declines, global smartphone panel shipments are expected to dip by 3.2%, totaling 2.093 billion units.
BOE retained its leading position among the top five smartphone panel makers with 613 million units shipped in 2024, and shipments are anticipated to grow 2.7% to 630 million units in 2025.
Samsung Display (SDC) ranked second, buoyed by robust demand for AMOLED panels from Apple and its own smartphone lineup, with 378 million units shipped in 2024. However, with Apple expected to diversify its supplier base in 2025, SDC’s shipments could see a slight decline of 3.5%, reaching 365 million units.
HKC cemented its third-place position following rapid growth in a-Si LCD shipments, achieving 228 million units in 2024. Leveraging the cost advantages of its G8.6 production line, HKC anticipates a slight uptick in 2025 shipments to 230 million units (+0.7%), though competition from CSOT may apply pressure.
CSOT saw significant growth, closely collaborating with Xiaomi, which boosted its 2024 shipments to 215 million units, an impressive 83.2% YoY increase. This momentum is expected to continue into 2025, with shipments reaching 223 million units.
Tianma rounds out the top five, shipping 158 million units in 2024. Although declining demand for LTPS LCD panels poses a challenge, increasing market interest in AMOLED is expected to drive a 10% increase in Tianma’s 2025 shipments.
TrendForce highlights that demand for AMOLED panels remains strong in 2024, propelling shipment growth across major panel makers—a trend likely to continue into 2025. Conversely, demand for LTPS LCD panels, commonly used in mid-to-low-end smartphones, is gradually weakening, posing significant challenges for suppliers specializing in this technology.
The rapid expansion of HKC and CSOT has led to a shrinking market share for Taiwanese a-Si LCD suppliers. Japanese panel makers have steadily withdrawn from the smartphone market, further reducing their share. Meanwhile, South Korean manufacturers continue to leverage their advanced flexible AMOLED technology to maintain dominance in the high-end segment, with a 20-21% market share in 2024.
Chinese manufacturers, driven by growing demand for both mid-to-high-end AMOLED and entry-level a-Si LCD panels, have aggressively expanded their market presence. In 2024, their combined market share is projected to reach 69.8% and may exceed 70% in 2025, solidifying their crucial role in the global smartphone supply chain.
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.