-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Compal Reports January 2025 Revenue
February 12, 2025 | Compal Electronics Inc.Estimated reading time: Less than a minute
Compal Electronics, Inc. announced its consolidated revenue for January 2025.
The company reported consolidated revenue of NT$55,330 million for January 2025, representing a 13.6% decrease compared to the previous month (December 2024) and a 13.6% decline year-over-year (YoY) compared to January 2024.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging
08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.
AI Is the Golden Track Reviving Electronics and PCBs
08/06/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamRemember 2021? Despite COVID, the electronics industry hit a high. Then came the slide. By 2023, the industry was deep in the red. With inflation, policy shifts, and exchange rate shocks, the problems were long, and the outlook was bleak. Recovery finally appeared in 2024, but it was fragile. Automotive electronics slumped, wireless demand stayed soft, and the ride up was anything but smooth. Yet, amid the uncertainty, one bright track emerged: artificial intelligence (AI).
Dana on Data: Best Practices in Interpreting Drawing Notes—‘Use Latest Revision’
08/07/2025 | Dana Korf -- Column: Dana on DataThe global nature of electronics manufacturing requires clear, consistent, and precise communication, particularly in technical documentation. An area where miscommunication often arises is in interpreting drawing notes—small lines of text with the potential to dramatically impact product quality, manufacturing efficiency, and customer satisfaction.