New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
February 6, 2025 | IPCEstimated reading time: 1 minute
A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance. AI solutions leveraging deep learning and edge computing technologies have shown significant improvements in AOI accuracy and efficiency.
While the white paper focuses on the application of computer vision AI for automating inspection (i.e., applying AI for pattern recognition on inspection images), the rapidly growing availability and maturity of generative AI presents future possibility in generating inspection criteria.
Key focus areas within the white paper include:
- AI systems explanation
- The use of AI in AOI
- Challenges with deploying AI on the manufacturing floor
- “AI Enhancement to AOI for PCBA” project
- Technical Strategy Recommendations
“AI has shown significant potential in the realm of AOI, particularly in improving detection accuracy, reducing manual intervention and improving production efficiency. It presents many opportunities for the electronics manufacturing industry to increase reliability, speed up time to market and reduce costs and time associated with manual adjustments to systems,” said Matt Kelly, IPC chief technology officer and vice president of technology solutions. “However, several challenges must be addressed before AI can be widely adopted on electronics manufacturing production floors. AI research, industry collaboration and an ecosystem of standards, will help close the gap in AI adoption within the electronics manufacturing industry.”
Download “Unlocking AI for Automated Optical Inspection" here.
Suggested Items
Kitron Wins Additional €7 Million Contract, Expanding Presence in Industrial Automation
06/06/2025 | KitronKitron has signed a significant manufacturing agreement with a leading customer in the industrial automation sector. The agreement covers electronics manufacturing services for a new generation of high-performance drive modules used in automation and motion control systems.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
New Companion Guide to ‘DFM Essentials’ Delivers Deeper, Practical PCB Design Insights
06/05/2025 | I-Connect007The Companion Guide to DFM Essentials: Tips for Designing for Manufacturing is now available for free download. Building on the popular Printed Circuit Designer’s Guide to... DFM Essentials, this new resource from American Standard Circuits and ASC Sunstone Circuits offers advanced, real-world guidance to help PCB designers streamline production and avoid costly pitfalls.
Orbel Corporation Integrates Schmoll Direct Imaging
06/04/2025 | Schmoll AmericaOrbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.
GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
06/04/2025 | GlobalFoundriesGlobalFoundries, working with the Trump Administration and with support from leading technology companies aiming to onshore critical components of their supply chain, announced plans to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities across its facilities in New York and Vermont.