The Test Connection, Inc. to Showcase Advanced Testing Solutions at SMTA Austin Expo & Tech Forum
February 4, 2025 | The Test Connection Inc.Estimated reading time: Less than a minute
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce its participation in the SMTA Austin Expo & Tech Forum on February 6, 2025 in Austin, Texas. As the company celebrates 45 years of service, TTCI continues to provide industry-leading expertise in in-circuit testing (ICT), functional test development, and boundary scan solutions to mission-critical industries, including aerospace, defense, medical, and automotive.
Certified to ISO 9001:2015 and ITAR Registered, TTCI delivers precision and reliability where failure is not an option. The company’s advanced test solutions help manufacturers ensure product quality, reduce defects, and optimize production efficiency.
In addition to its industry-leading testing services, TTCI recently launched The Training Connection, LLC (TTC-LLC), an initiative aimed at empowering engineers and professionals through expert-led courses. TTC-LLC offers Design for Test (DFT) training, IPC standards certifications (610, 600, 620), and advanced soldering techniques at multiple locations, including Tampa and Baltimore. This expansion underscores TTCI’s commitment to advancing electronics manufacturing through both innovation and education.
Attendees of the SMTA Austin Expo & Tech Forum are invited to connect with TTCI to learn more about its cutting-edge test solutions and TTC-LLC’s professional training programs.
Suggested Items
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/16/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.