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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Laser Photonics Propels R&D Efforts in Wafer Marking
February 4, 2025 | BUSINESS WIREEstimated reading time: 1 minute
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser), announced the expansion of their Laser Wafer Marking technology research and development program.
High-precision Laser Wafer Marking technologies are designed for engraving serial numbers and other critical information on silicon and compounds used in the semiconductor industry.
“By integrating CMS Laser’s expertise with our advanced R&D initiatives, we are committed to providing chip manufacturers with the most sophisticated laser wafer processing systems,” said John Armstrong, Executive Vice President of LPC. “We are ready to support fabs in the United States and abroad amidst the ever-growing demand for chips and the regulatory stimulation of the sector.”
CMS Laser’s cutting-edge laser marking technology is designed with custom configurations for each client, including the laser type, product transport and handling, machine vision, and fume extraction. Engineers can tailor the process to accommodate virtually all specific needs, including integrating seamlessly with existing databases, connecting to sophisticated Surface Mount Technology (SMT) lines, incorporating external stackers and destackers, adopting various flipping configurations, or robotics integration.
CMS Laser prides itself on working with the end user to create a solution that integrates into their manufacturing environment and accepts engineering challenges that other laser system companies turn down.
Developed to meet the most demanding requirements, CMS Laser’s laser marking systems deliver unrivaled performance, making them an indispensable asset in advanced wafer processing. Chip manufacturers can rely on these innovative systems to enhance production, with precision, speed, and adaptability providing a remarkable competitive edge, ensuring accurate, uniform results in every batch.
Suggested Items
IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
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The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
The Evolution of Picosecond Laser Drilling
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Altus, Danutek Expand Partnership with LPKF to Offer Laser Plastic Welding Solutions
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