WISE s.r.l., Parma, Italy, Announces Continued Success For 2024
February 3, 2025 | WISE s.r.lEstimated reading time: 2 minutes
Wise s.r.l., a leading provider of wet and mechanical process equipment for the printed circuit board industry, announced its strong performance for 2024, achieving a 19% increase in sales over the past year and a 40% growth over the last two years.
Massimo Passerini, who has recently been appointed as the new CEO of Wise, expressed the company’s satisfaction with its sustained growth in both sales and market share over the past five years. Wise’s continued success is driven by its commitment to technology, quality, and a solid financial foundation, allowing the company to expand its customer base across Europe and the United States. While Wise has long held a significant share in the mechanical process equipment market, it has also made substantial gains in the wet process equipment sector in both regions.
To address the company’s continued growth in sales and equipment manufacturing, Wise has expanded its production facilities twice in the past five years. The most recent expansion, completed in late 2024, increases the manufacturing space by 50% and will provide the capacity to meet the rising demand for their products.
Passerini credited the company’s growth to its performance in Europe and the United States. Wise’s sales team and its distributors abroad have played a crucial role in the company’s success. Wise’s distributors have made significant investments in spare parts and service personnel over the past few years to support the growth in these territories, particularly Technica in the United States.
Wise and its distributors remain committed to enhancing customer service. In addition to expanding spare parts availability in Italy and in warehouses on both the East and West coasts of the United States, Wise provides ongoing, high-quality training for its technical service team abroad. Training sessions, held twice a year, ensure the 10-member service team stays up to date with the latest advancements in equipment design and maintenance.
Looking ahead, Wise anticipates continued growth in 2025 and beyond. With the ongoing performance and support from its distributors, the company will continue to invest in personnel and R & D to strengthen its position as a leading force in the industry.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.