-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
China’s Smartphone Market Rebounds with 5.6% Growth in 2024, Fueled by vivo and Huawei
January 30, 2025 | IDCEstimated reading time: 1 minute
According to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker, China's smartphone market shipped 76.4 million units in 4Q24, a 3.9% year-on-year (YoY) increase. This growth was driven by new product launches and government subsidies initiated in some provinces and cities. For the full year 2024, the Chinese market shipped 286.2 million units, a 5.6% YoY growth, marking a recovery after two years of decline thanks to pent-up demand and innovations like GenAI.
“The recovery is a boon to the smartphone industry, but not all OEMs have benefited from the growth as consumers are becoming more selective,” said Will Wong, senior research manager for Client Devices at IDC Asia/Pacific. “This implies a value-seeking trend that is prevalent not only in China but also globally. Market players need to adapt to this shift in consumer behavior if they want to continue to capitalize on the recovery.”
- vivo led the Chinese market in 2024, driven by its user-centric approach across all price segments as well as the focus on both hardware and software development.
- Huawei made a strong comeback, securing second place for the full year 2024 with over 50% shipment growth, supported by improvement in the supply chain capability.
- Apple achieved the number 1 spot for the quarter, however it saw its market share and shipments shrink in 2024 due to increased competition in the market and uncertainty around launch of Apple Intelligence in China.
- Honor remained a top five OEM amid the intense competition. The vendor focused on product differentiation and innovation while achieving overseas growth.
- OPPO rebounded with shipment growth in 4Q24, driven by increased investment in mid- to high-end products and the success of its Find X8 series.
“The market recovery is expected to be supported by government subsidies in 2025,” said Arthur Guo, senior research analyst in Client System Research for IDC China. “This presents an opportunity for market players to adapt their strategies by leveraging these government’s initiatives.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
07/23/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
DuPont Publishes 2025 Sustainability Report
07/22/2025 | PRNewswireDuPont published its 2025 Sustainability Report detailing the progress made toward achieving its 2030 Sustainability Goals.