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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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IEC Collaborates with Supply Partners at IPC APEX EXPO 2025
January 29, 2025 | IECEstimated reading time: Less than a minute
In keeping with its company's Supply Chain Motto of Collaboration – Innovation – Quality – Dedication, International Electronic Components, Inc. is excited to announce its collaboration with five other companies at the upcoming IPC APEX EXPO 2025.
IEC will be sharing a booth (#3938) with the following Supply Partners: Pluritec, Eternal Technology Corporation, RBP Chemical Technology, Inc., Sigma-Mecer, and SUSS MicroTec.
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