Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop
January 22, 2025 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.
With the continued rise in demand for high-performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
The iMAPS Wire Bonding 2025 Workshop and Tabletop Exhibition is an advanced technical workshop presenting a unique forum to unite scientists, engineers, manufacturing, academia and others working in Wire Bonding. The workshop was established to provide a platform for presentations and debate regarding the latest technologies and applications of Wire Bonding use in battery pack, semiconductor, and microelectronic packaging.
Share on:
Suggested Items
The Wire Association International’s Wire Expo to Co-Locate with the Electrical Wire Processing Technology Expo (EWPTE)
07/16/2025 | Global Electronics AssociationThe Wire Association International Inc. (WAI) announces plans to co-locate its biennial Wire Expo with the Wiring Harness Manufacturer’s Association (WHMA)/Global Electronics Association’s Electrical Wire Processing Technology Expo (EWPTE) May 6-7, 2026. The two shows will co-locate at the Baird Center, Milwaukee, Wisconsin, USA.
Reshoring Expert to Speak at WHMA Global Leadership Summit
07/16/2025 | Nolan Johnson, I-Connect007The 2026 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this industry that constantly evolves with new technology and practices. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs, and suppliers to companies that build wiring harnesses and cable assemblies.
Redwire Announces Addition of the Edge Autonomy Stalker Uncrewed Aerial System to DoD’s Blue List of Approved Drones
07/14/2025 | BUSINESS WIRERedwire Corporation, a global leader in aerospace and defense technology solutions, announced that the Stalker uncrewed aerial system (UAS), developed by Redwire’s wholly owned subsidiary Edge Autonomy, has been granted an Authority to Operate (ATO) and is now on the Defense Innovation Unit (DIU) Blue UAS List.
ASMPT Introduces AERO PRO High-Performance Wire Bonder
07/09/2025 | ASMPTASMPT, the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, introduces its latest high-performance wire bonder: the AERO PRO.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.