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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

Amphenol Printed Circuits Shows PCBs of All Sizes at 2026 IEEE MTT-S

05/22/2026 | Amphenol Printed Circuits
Amphenol Printed Circuits (APC) will once again be bringing examples of their printed circuit board (PCB) design and manufacturing skills to the RF/microwave industry’s major annual technology event, 2026 IEEE MTT-S International Microwave Symposium (IMS), June 9–11, at the Thomas M. Menino Convention & Exhibition Center in Boston.

Express Manufacturing, Inc. Expands Inspection Capabilities with Its 2nd TRI AXI

05/18/2026 | Express Manufacturing, Inc.
Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added a new TR7600FB SII from Test Research, Inc., further strengthening its inspection capabilities for complex, high-reliability assemblies.

DISTRON Expands In-House Capabilities with Automated Conformal Coating for Complex PCBA

04/02/2026 | Distron Corp.
DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, has expanded its manufacturing capabilities with the addition of in-house automated conformal coating, designed to support complex PCB assemblies and high-reliability applications.

Learning with Leo: Why Risk-based Auditing Is Reshaping Cable Assembly Quality

04/01/2026 | Leo Lambert -- Column: Learning With Leo
Effective product development requires early and active participation from all stakeholders. The design process must include input from supply chain, manufacturing engineering, purchasing, quality, and production. A design cannot be considered complete until it has been evaluated against the full manufacturing process, whether executed by an OEM or a subcontractor. Without this collaboration, designs are often released that are not manufacturable in real-world conditions.
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