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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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A University Model for Training the Next Generation of PCB Designers

08/19/2026 | Marcy LaRont, I-Connect007
Veteran PCB designer and educator John Watson has building one of the nation's most comprehensive university-based PCB design certificate programs in the country. He’s working with Palomar College, UC San Diego, UC Santa Cruz, and UMass Lowell to teach the complete design-to-manufacturing process while connecting students with internships and career opportunities. I spoke with John about the industry's workforce challenges, building meaningful educational pathways, and why the next generation of PCB designers may come from places few would expect.

All Flex Expands Reach Through Flex Interconnect Technologies Acquisition

08/19/2026 | Marcy LaRont, I-Connect007
A strategic partnership between Minnesota-based All Flex Solutions and Flex Interconnect Technologies (FIT) will provide value-added engineering and quick-turn, prototype flexible PCB manufacturing with All Flex’s high-volume flex fabrication. The new alliance offers customers a more comprehensive flex solution and an opportunity to streamline their flex PCB supply chain. All Flex CEO John Fallon discusses the strategic rationale behind the partnership, the benefits of having a “100-year plan,” and how the combined organization is positioning itself for optimum growth.

Technica USA Announces Strategic Partnership with Rehm Thermal Systems

08/18/2026 | Technica USA
Technica USA is pleased to announce a new strategic partnership with Rehm Thermal Systems. Under the distribution agreement, Technica USA will represent Rehm throughout the Western and South-West Central regions of the United States.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Charles Wert Named President of ASC Sunstone Circuits

08/17/2026 | American Standard Circuits
Anaya Vardya, CEO of American Standard Circuits and ASC Sunstone Circuits, has announced the appointment of Charles Wert as President of ASC Sunstone Circuits.
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