AIM to Participate in SMTA Ultra High Density Interconnect Symposium

Estimated reading time: 1 minute

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona. As a proud member of SMTA, AIM Solder is committed to advancing the industry’s knowledge and capabilities through collaboration and innovation.

The UHDI Symposium provides a unique platform for professionals in the semiconductor and electronics industries to explore the latest advancements in PCB design, fabrication, assembly, and reliability. This year’s event will address key topics, including miniaturization in assembly, breakthroughs in PCB fabrication, design for manufacturability (DFM), and emerging technologies such as LCP with 10-micron embedded traces. Attendees will gain insights into how these innovations are driving the industry toward smaller, more powerful, and reliable technologies.

AIM Solder’s Gayle Towell will be a featured panelist during Session 4 at 4:00 PM, contributing to the discussion, “Bridging the Gap: Accelerating Ultra HDI Adoption Through Collaboration.” The panel will explore strategies for fostering partnerships across the supply chain to streamline UHDI adoption and enhance technological outcomes.

“As the electronics industry continues its push toward miniaturization and UHDI, AIM remains at the forefront, delivering innovative solutions and expert technical support to address these challenges,” said Gayle Towell. “We are excited to contribute to this critical dialogue at the UHDI Symposium.”