-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Ensuring Compliance With the U.S. CHIPS Act: Identifying the Source of Electronic Components
January 13, 2025 | Dr. Eyal Weiss, CybordEstimated reading time: 1 minute

The U.S. CHIPS Act aims to strengthen domestic semiconductor manufacturing and enhance supply chain security. As part of this initiative, manufacturers must ensure compliance with specific regulations regarding the sourcing of electronic components. This white paper provides an overview of the compliance requirements, relevant laws and standards, and introduces innovative technological solutions to verify the provenance of electronic components. Moreover, it highlights the importance of comprehensive verification that extends beyond sourcing to include the production stage, finished goods, and semi-finished products. By ensuring that all components are original and have not been tampered with at any point in the supply chain, manufacturers can maintain product integrity and uphold regulatory compliance.
1. Compliance Requirements and Relevant Laws
The CHIPS Act emphasizes the importance of transparency and traceability in the semiconductor supply chain. Essential compliance requirements include:
- Documentation of origin: Companies must maintain detailed records documenting the origin of all electronic components used in production.
- Verification processes: Manufacturers are required to implement processes that ensure the authenticity of the source of their components, reducing reliance on potentially fraudulent documentation.
- Adherence to standards: Compliance with industry standards such as IPC-1752A (Material Declaration Management) and ISO 9001 (Quality Management Systems) is essential for ensuring quality and traceability.
2. Current Solutions: A Trust-Based Approach
Despite the clear regulations, current solutions predominantly rely on trust. Manufacturers depend on paper reports and documentation provided by the supply chain to verify the sources of their components. This approach has significant drawbacks:
- Lack of ground truth: Existing methods do not provide a technological means to obtain ground truth regarding the origins of components. Verification is limited to the accuracy of documents and trust in suppliers.
- Increased risk: The reliance on paperwork increases the risk of fraud and misrepresentation, which can lead to non-compliance and reputational damage.
To continue reading this article, which originally appeared in the January 2025 SMT007 Magazine, click here.
Suggested Items
Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years
06/26/2025 | Count On ToolsCount On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
06/26/2025 | ECTCThe 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.