Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years

06/26/2025 | Count On Tools
Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.

A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)

06/26/2025 | ECTC
The 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:

The Death of the Microsection

06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.
I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.

Specially Developed for Laser Plastic Welding from LPKF

06/25/2025 | LPKF
LPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.

Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices

06/26/2025 | Team NCAB -- Column: Fresh PCB Concepts
Micro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved. Log in