Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
American Made Advocacy: New Congress, New Opportunities
Ensuring Compliance With the U.S. CHIPS Act: Identifying the Source of Electronic Components
January 13, 2025 | Dr. Eyal Weiss, CybordEstimated reading time: 1 minute
The U.S. CHIPS Act aims to strengthen domestic semiconductor manufacturing and enhance supply chain security. As part of this initiative, manufacturers must ensure compliance with specific regulations regarding the sourcing of electronic components. This white paper provides an overview of the compliance requirements, relevant laws and standards, and introduces innovative technological solutions to verify the provenance of electronic components. Moreover, it highlights the importance of comprehensive verification that extends beyond sourcing to include the production stage, finished goods, and semi-finished products. By ensuring that all components are original and have not been tampered with at any point in the supply chain, manufacturers can maintain product integrity and uphold regulatory compliance.
1. Compliance Requirements and Relevant Laws
The CHIPS Act emphasizes the importance of transparency and traceability in the semiconductor supply chain. Essential compliance requirements include:
- Documentation of origin: Companies must maintain detailed records documenting the origin of all electronic components used in production.
- Verification processes: Manufacturers are required to implement processes that ensure the authenticity of the source of their components, reducing reliance on potentially fraudulent documentation.
- Adherence to standards: Compliance with industry standards such as IPC-1752A (Material Declaration Management) and ISO 9001 (Quality Management Systems) is essential for ensuring quality and traceability.
2. Current Solutions: A Trust-Based Approach
Despite the clear regulations, current solutions predominantly rely on trust. Manufacturers depend on paper reports and documentation provided by the supply chain to verify the sources of their components. This approach has significant drawbacks:
- Lack of ground truth: Existing methods do not provide a technological means to obtain ground truth regarding the origins of components. Verification is limited to the accuracy of documents and trust in suppliers.
- Increased risk: The reliance on paperwork increases the risk of fraud and misrepresentation, which can lead to non-compliance and reputational damage.
To continue reading this article, which originally appeared in the January 2025 SMT007 Magazine, click here.
Share on:
Suggested Items
Gold as a Key Component in PCBs and IC Substrates
03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' AtotechGold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.
Cybord Unveils AI-Powered Real-Time Interception (RTI) Solution to Prevent Defective Electronic Products
03/14/2025 | PRNewswireCybord, the leading provider of advanced AI-powered electronic component analytics, announced the launch of its Real-Time Interception (RTI) solution, an advanced visual AI-powered software that prevents defective components from being assembled onto Printed Circuit Board Assemblies (PCBAs) in real time.
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
ASMPT: New Stationary Camera for SIPLACE Placement Machines
03/13/2025 | ASMPTMarket and technology leader ASMPT is offering a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN. It delivers significantly faster processing speeds as well as more component flexibility – from highly integrated ball grid arrays (BGAs) to large-format odd shape components (OSCs).
Statement from IPC, the Global Electronics Association, on Recent U.S. Tariffs and Global Trade
03/07/2025 | IPCIPC shared the following statement today on U.S. tariffs and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO: