I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 10, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 3 minutes

“Baby, it’s cold outside!” Though certain holiday tunes are still lingering in my head, we are indisputably in the new year. For our companies, we are just warming up (pun intended) for the year as, for the first time in nearly two months, all of us are finally back in the office. So, let the productivity (re)commence.
In the past couple of weeks, we’ve had some big industry news. In the automotive world, Honda and Nissan merged to form the largest car manufacturer in Japan. Before President Biden left office, he made sure to distribute more CHIPS Act money to bring some measure of electronics manufacturing back to the U.S. And former President Jimmy Carter died at the age of 100 and was honored on Thursday, reminding us all what true integrity looks like.
For the electronics manufacturing industry, here are my must-reads for the week.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Published January 7
Vern Solberg’s column seems a fitting article to feature, highlighting the impact of semiconductor packaging requirements on the printed circuit board, and advising PCB designers on the best way to approach their delicate work given the many requirements in front of them. Not surprisingly, he spends a fair amount of time talking about stackups and the need (or not) to work with the fabrication facility, but also highlights that most CAD tools now offer the ability for designers to provide a stackup to the fabricator, though it may well change in the fabricator’s hands. If you are a PCB designer, or a fabricator looking for a better understanding of the designers providing you with data, take a few minutes for this read.
Expansion, Retirement, and New Leadership at FCT
Published January 9
Flexible circuit board supplier Flexible Circuit Technologies (FCT)’s Carey Burkett talks about his company’s plans as they enter a new year. He has announced his eventual retirement and brought EMS professional Ray Cottrell into the FCT fold to transition into Carey’s role and develop FCT’s EMS and inTflex integrated solutions offering to customers. Their enthusiasm and passion were evident throughout our interview. I will be watching to see all they accomplish in 2025 and beyond.
EMS Providers Should ‘Plan Prudently’ in 2025
Published January 8
In his interview with Dennis Reed of Edgewater Research and IPC’s Mark Wolfe, Nolan Johnson tackles the question as to what EMS providers should plan for in 2025. He cites such situations as the change in the U.S. administration, tariffs, how company spending will be affected by economics, nearshoring and the relationship between China and the West, industry competition, supply chains, and more. This is a great market outlook piece and valuable read.
American Standard Circuits’ Anaya Vardya to Keynote PanPac Summit 2025
Published January 9
Amidst the lineup of winter tradeshows is the PanPac Summit, held each year in Hawaii. This year, the keynote speaker will be Anaya Vardya, CEO of American Standard Circuits (ASC). Anaya has been an innovator in the PCB sector from the moment he joined the industry, and his work in the UHDI space is notable. The keynote takes place Jan. 28 and is titled “Ultra High-Density Interconnects (UHDI): A Global Innovation in Electronics Assembly.”
It’s Only Common Sense: Making 2025 the Best Sales Year Ever
Published January 6
Fan favorite, Dan Beulieu’s column this week is bound to get some attention. As we each embark on 2025, we are all focused on sales and revenue. Given all the economic realities with which we must contend, any wisdom Dan can impart as to how we might make 2025 the best sales year ever are certainly welcome. Dan gives 10 tips to help assure success. It is advice worth heeding.
Marcy LaRont Named I-Connect007 Executive Director
Published January 8
As a bonus sixth item this past week, I want to highlight a significant leadership change at I-Connect007. Barry Matties, who has been an industry publisher since 1986, will remain as executive director for several months as I now succeed him. Barry’s long service to the industry has played a foundational role in setting a standard for electronics manufacturing trade media. As I now lead this organization, I look forward to all that is ahead for I-Connect007 publications and products and continuing to provide you with the highest level of news, technical, and business information you have come to count on. Please know that I welcome your feedback and input. Contact me at marcy@iconnect007.com.
Suggested Items
LITEON Technology Reports 2024 EPS of NT$5.21 Q4 Sales Reached NT$38.3 Billion
02/27/2025 | LITEON TechnologyLITEON Technology reported the fourth quarter consolidated sales of NT$38.3 billion, up 4% Y-o-Y. Cloud & AIoT achieved an annual growth of over 20%, driving overall revenue back to a positive growth trajectory.
Technica USA and Electra Polymers: Driving Success in Ink Jet Solder Mask Across North America
02/27/2025 | Technica USATechnica and Electra Polymers have achieved remarkable success in the ink jet solder mask market. Electra Polymers is the dominant force in North America, holding an overwhelming market share north of 80% with its ElectraJet® EMJ110 solder mask.
AT&S Appoints Dr. Michael Mertin as New CEO
02/26/2025 | AT&SThe Supervisory Board of AT&S decided to appoint Dr. Michael Mertin as member of the Management Board and Chief Executive Officer (CEO) of the company with effect from May 1, 2025 and a term of three years.
Yamaha Motor to Launch New YRP10e Entry-Level Solder Paste Printer
02/26/2025 | Yamaha Motor Europe Robotics, SMT SectionYamaha Motor Europe Robotics SMT Section announces that it will release the new YRP10e solder paste printer on April 1 of this year.
Discover the New Podcast Series on Thermal Management—Now Available
02/27/2025 | I-Connect007In this premiere podcast episode, Ryan Miller of NCAB breaks down why thermal management is a must for PCB designers. What are the main causes of excess heat in our designs today? Why does it matter? And how can designers keep their boards cool under pressure?