Dan’s Biz Bookshelf: 'This Is Strategy: Make Better Plans'
The Chemical Connection: Reducing Defects in Circuit Board Production
It’s Only Common Sense: Trust Is All You Need
TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego
January 9, 2025 | TopLineEstimated reading time: Less than a minute
TopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.
The objective of the Wire Bonding Workshop is to create a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people from around the world who have been working in the area of Wire Bonding. According to TopLine CEO Martin Hart, “This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies available related to the use of Wire Bonding in battery packs, and in semiconductor and microelectronic packaging.” The workshop will be held at the Westin San Diego Bayview.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment
05/30/2025 | MicrosemblyMicrosembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.
ASMPT Presents Die Bonder with Intelligent Features
05/14/2025 | ASMPTASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)
03/24/2025 | ASMPTASMPT, the world’s leading provider of pioneering solutions for advanced packaging and semiconductor assembly, will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3 at the Moscone Center in San Francisco, California (USA).