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INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b

04/28/2025 | iNEMI
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.

Laird Thermal Systems Announces Max Kley as New CEO

04/18/2025 | Laird Thermal Systems
Laird Thermal Systems (LTS) is pleased to announce the appointment of Dr. Max Kley as its new Chief Executive Officer, effective April 1, 2025. Max Kley brings a wealth of international leadership experience to LTS, having successfully led and developed businesses across the USA, Europe, and Asia.

New TSN-MACsec IP Core for Secure Data Transmission in 5G/6G Communication Networks

04/15/2025 | Fraunhofer
Reliability and security in broadband communication networks (5G/6G) are crucial for meeting the challenges of the digital future. Together with aconnic AG, Fraunhofer IPMS has developed an innovative IP core as part of the “RealSec5G” project, which combines the advantages of a MACsec IP core with those of a Time-Sensitive Networking (TSN) IP core.

Jabil Posts Second Quarter Results; Raises Fiscal 2025 Outlook

03/21/2025 | Jabil
“I am very pleased with our strong year-to-date results, which underscore the resilience and strength of our diversified portfolio. In Q2, we exceeded our expectations due to continued strength in our capital equipment, cloud and data center infrastructure, and digital commerce end-markets,” said CEO Mike Dastoor. “

Imec Demonstrates Electrical Yield for 20nm Pitch Metal Lines Obtained with High NA EUV Single Patterning

02/26/2025 | Imec
At SPIE Advanced Lithography + Patterning, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents the first electrical test (e-test) results obtained on 20nm pitch metal line structures patterned after single-exposure High NA EUV lithography.
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