The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Schmoll: Decades of Technology Evolution
It’s Only Common Sense: The Danger of Overthinking
SMTA Announces Wafer-Level Packaging Symposium Program
January 8, 2025 | SMTAEstimated reading time: 1 minute
The SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
The technical program features a special keynote presentation. On Wednesday, February 19, 2025, Eric Breckenfeld, Nvidia, and Erik Hadland, Semiconductor Industry Association, will co-present, “The CHIPS and Science Act: Past, Present and Future of U.S. Microelectronics R&D.”
Technical sessions include over 20 expert speakers who delve into wafer-level packaging advances, assembly/integration process, novel interconnect & packaging process and materials, substrate/integration platform, test & metrology, fan-out wafer-level packaging, and more. The program features presentations from leading companies including adeia, Nvidia, NHanced Semiconductors, Semiconductor Industry Association, and universities such as Hanyang University, Yokohama National University, and more.
The symposium kicks off with two professional development courses on Tuesday, February 18, 2025. The first course, “Materials for Semiconductor Packaging,” will be instructed by Terry Alford, Arizona State University. Gamal Refai Ahmed, Ph.D., AMD, will instruct the second course, “Current & Future Challenges and Solutions in AI & HPC System & Thermal Management.” Access to these courses is included in standard registration.
Registration for this event is open. Click here to register. Discounted rates are available by registering on or before January 27, 2025. All presentations, professional development courses and events open to attendees are included in registration.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Aegis—Advancements in AI and Cybersecurity Compliance
03/28/2025 | Real Time with...IPC APEX EXPOIn this interview, Jason Spera of Aegis Software discusses the impact of AI on data models and operational capabilities. He highlights customer feedback on MES systems, emphasizing the need for comprehensive reporting. Aegis has a new inventory auditing system that supports incremental audits, ensuring productivity.
Sypris Reports Fourth Quarter Results
03/27/2025 | BUSINESS WIREThe Company’s gross profit for the quarter increased 23.1% from the prior-year period, while gross margin expanded 350 basis points.
Rocket Lab Successfully Launches Mission for Global Wildfire Detection Company OroraTech
03/27/2025 | BUSINESS WIRERocket Lab USA, Inc., a global leader in launch services and space systems, today successfully launched its latest mission within four months of contract signing for Germany-based global wildfire detection company OroraTech.
LPKF Reports Results for Full Year 2024
03/27/2025 | LPKFThe technology company LPKF Laser & Electronics SE published today its annual report for 2024. Despite the challenging economic conditions for the German mechanical engineering industry, LPKF was able to maintain its revenue slightly below the previous year's level at EUR 122.9 million.
25 Years of IPC APEX EXPO: Alicia Balonek Reflects on a Milestone
03/28/2025 | Alicia Balonek, IPCAs I celebrate my 25th work anniversary with IPC, I can’t help but reflect on my incredible journey. From its inception in 2000, IPC APEX EXPO has evolved into one of the most anticipated and dynamic events in the electronics industry, and I’m proud to have been a part of its growth every step of the way.