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RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research

01/16/2025 | Siemens
Siemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce™

Siemens, Sony Deliver Breakthrough Immersive Engineering for the Industrial Metaverse

01/09/2025 | Siemens Digital Industries
Siemens Digital Industries Software, in collaboration with Sony Corporation, announced today that it is delivering on its next-generation immersive engineering roadmap that brings together Siemens’ NX software for product engineering with Sony’s breakthrough head-mounted display (HMD) to enable the industrial metaverse.

Siemens Extends Veloce Hardware-assisted Verification Support of EPGM Ethernet to 1.6 Tbps

12/18/2024 | Siemens
Siemens Digital Industries Software announced today an extension of its Veloce™ hardware-assisted verification platform to support 1.6 Tbps Ethernet. As a core component of the Siemens software/hardware and system validation platform, Veloce delivers complete virtual models to support Ethernet Packet Generator and Monitor (EPGM) Ethernet port speeds up to 1.6 Tbps.

Siemens’ Solido SPICE Now Certified for Multiple Leading-edge Samsung Foundry Processes

11/27/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido™ SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP and 3D-IC semiconductor designs. 

Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency

11/21/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
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