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Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update

I’m Denny Fritz, the author of 30 “Defense Speak Interpreted” columns from 2018 to 2022. My original concept for this monthly op-ed was to explain the unique acronym language used by the U.S. Defense Department: CMMC, DIUx, C4ISR, JEDI, etc. When I started consulting for NSWV Crane almost 20 years ago, I would find myself sitting in meetings, perplexed at what I heard. Half the conversations were using acronyms that were foreign to me. I perceived it as another language, “defense speak.” But I wasn’t too far off base. I later learned that the DOD Dictionary of Military and Associated Terms has 124 pages just for abbreviations, acronyms, and initialisms, besides the 255 pages of definitions.

So, for three years, I wrote a column for I-Connect007, helping to decipher those terms: what the organization or project was, what was happening with it, and how it impacted defense electronics.

However, I took a break from writing the column because, for the past three years, I have been heavily involved with the U.S. Partnership for Assured Electronics (USPAE), working on a standard for all solders to be used in assembling defense electronics, including Pb-free solders. That effort is toward MIL-PRF-xx732, Performance Specification–Solder. The USPAE team has submitted several standards versions for Defense review and continues to fine tune that document. However, the companion solder handbook, MIL-HDBK-537, Guidance for the Acquisition and Sustainment of Soldered Defense Electronic Products, was first issued Aug. 17, 2022, at just 15 pages. Even before the official issue, Rev A of Handbook 537 has been underway and, as presently configured, contains the main document and nine appendix chapters. The final approval activity is underway for the handbook also, and now I can get back to Defense Speaks Interpreted.  

My intent going forward is to review and update some of my previous columns and to sprinkle in newer topics. One looming topic is whether the CHIPS Act funding for semiconductors/electronic interconnections will survive the current cutbacks in D.C. Remember the slogan for domestically manufactured electronic substrates, “Chips don’t float,” and that is commonly judged to need federal and DoD support.

My plan over the next year is to cover the Continuing Resolution and budget process, the ins and outs of the CHIPS Act, an update on DARPA ERI and JADC2, look at non-CHIPS programs (Crane OTAs and Defense Sustainment), provide an update on Skyborg, examine the Defense’s view of interconnection and packaging, update Hypersonics, and then at the end of the year summarize the changes in 2025.

I am renewing this column at a very confusing time for not only the Defense Department, but the entire U.S. government. First, the Department of Governmental Efficiency (DOGE) has signaled to Defense to plan for a 5–8% reduction in headcount for the next five years annually1. This amounts to a 40% overall cut.

This flies in the face of the proposed increased Defense budget that came from the Biden White House about a year ago, and was basically agreed to in the House and Senate last fall.   

Second, Defense is caught in the middle of the budget argument. The deadline to do something was March 14. There appears to be no chance of a full Defense budget, so the presumption is that a “Continuing Resolution” will be passed. That is, spend no more this year than was spent in FY 2024.  Sadly, it also means new programs cannot be initiated, despite the need for modernized weapons. That dust should be settled by the time of my next column in April.  

In February, Elon Musk of DOGE asked all federal employees to summarize in an e-mail what five things they had accomplished in the past week2. That presumes that some people on the payroll are doing nothing. The DoD confusion arises as many DoD employees work on classified tasks and cannot report what they do, without the document being declared “secret”.  In a March 1 clarification, Defense Secretary Hegseth told DoD employees “not to include classified or sensitive information in their responses. After telling employees to disregard the first round, the Defense Department is now mandating its workers to respond to the email. Hegseth wrote in a Thursday memo that submissions should not include classified or sensitive information and that non-compliance could lead to further review3.

While direct civilian employees of the Defense Department are dealing with the above reporting problems, the subcontracting companies to DoD are under scrutiny, also, where “a recent statement asked for a $50 billion reduction in billings from the top 10 civilian contractors to Defense.”4 Nothing specific is mandated, but employee headcount reductions seem the most logical.  

So, it seems I have my work cut out for me to keep you current on Defense activities in the anticipated turbulent times ahead. And that is without even considering the world events that could quickly alter the Defense strategy: the Middle East, Taiwan, Ukraine, etc. It will be interesting, to say the least.

References

1. “Defense Department begins first round of layoffs,” by Anastasia Obis, Federal News Network, March 6, 2025.
2. “Trump Administration, Breaking With Musk’s Directive, Says Replying to His Email Is Voluntary,” by Michael D. Shear and Kate Conger, The New York Times, Feb. 24, 2025 (updated Feb. 26).
3. “Many federal employees ordered to submit recent accomplishments for second Musk email,” Government Executive, March 3, 2025.
4. “DoD reviewing ‘non-essential’ consultancy contracts for termination,” by Theresa Hitchens, Breaking Defense, Feb. 20, 2025.

Dennis Fritz was a 20-year direct employee of MacDermid Inc. and retired after 12 years as a senior engineer at (SAIC) supporting the Naval Surface Warfare Center in Crane, Indiana. He was elected to the IPC Hall of Fame in 2012.