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Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?

02/19/2025 | Chrys Shea, SHEA Engineering Services
UHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago. 

EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability

02/19/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.

Unimicron Wins 17th Taiwan Corporate Sustainability Award

01/31/2025 | Unimicron
Unimicron (3037) has been adhering to a stable management and sustainability concept, promoting corporate sustainability actions, and actively playing a core role in the ESG wave.

KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop

01/22/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview.

The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?

01/21/2025 | Martyn Gaudion -- Column: The Pulse
As we enter the second quarter of the 21st century, there appears to be a new chapter in PCB technology. Ultra high density interconnect (UHDI) has become a buzzword, but it’s actually not that new; many of the processes were already established in the high-volume production of Asian cell phones and tablets. What is new and challenging, however, is migrating the line widths and stackups—once the domain of handheld consumer products—into the lower volume specialized environment of the commercial world.
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