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Nano Dimension Announces CEO Transition
January 2, 2025 | Globe NewswireEstimated reading time: Less than a minute
Nano Dimension Ltd., a supplier of Digital Manufacturing solutions, announced that the board of directors has appointed Mr. Julien Lederman as Interim Chief Executive Officer (CEO) of the Company. Yoav Stern’s role as CEO has been terminated, effective immediately. The Board is conducting a comprehensive search for a permanent CEO.
Julien Lederman, who has served as Vice President of Corporate Development since March 2021 will serve as Interim CEO. Previously, Lederman was employed at Amazon.com, Inc., The Goldman Sachs Group, Inc., Lehman Brothers Holdings, Inc., and the World Economic Forum. He earned an MBA from INSEAD in France in 2013 and a BA from Colgate University in New York in 2008.
Yoav Stern had been serving as CEO and a member of the Board since January 2020. As previously announced, at the Company’s 2024 annual general meeting of shareholders, dated December 6, 2024, Stern was not re-elected as a director.
Ofir Baharav, Chairman of the Board, commented: “The Board is pleased and confident in our appointment of Julien Lederman as Interim Chief Executive Officer. The Board fully supports Julien during this transition period while we conduct a broad search for a permanent Chief Executive Officer.”
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Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
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Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment
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Amar Maletira Appointed to Celestica’s Board of Directors
01/07/2025 | CelesticaCelestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world’s most innovative companies is pleased to announce the appointment of Amar Maletira to its Board of Directors, effective January 1, 2025.