-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Hon Hai Research Institute Publishes AI-Driven Silicon Carbide Technology in IEEE OJPEL
January 1, 2025 | Hon Hai Technology GroupEstimated reading time: Less than a minute
Hon Hai Technology Group announced that its Semiconductor Research Institute has successfully combined AI learning models with reinforcement learning to accelerate the research and development of silicon carbide power semiconductors. This breakthrough research, published in the esteemed IEEE Open Journal of Power Electronics (OJPEL), demonstrates the significant potential of AI in advancing third-generation semiconductor technology.
By leveraging reinforcement learning, Hon Hai Research Institute has optimized the process parameters and component design of silicon carbide materials. This approach allows for more efficient and accurate predictions, reducing the need for extensive trial and error in the development process. The research team successfully applied this method to the design of protective rings for high-voltage and high-power silicon carbide components, achieving significant improvements in performance.
Silicon carbide power semiconductors are crucial for high-power applications such as electric vehicles, smart grids, and aerospace systems. Hon Hai's research advances the capabilities of these critical components, enhancing their stability and reliability for demanding applications.
Moving forward, Hon Hai Research Institute will continue to integrate AI with semiconductor research and development, driving innovation and expanding the applications of high-power components.
Suggested Items
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research
01/16/2025 | SiemensSiemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce™
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
01/16/2025 | SIAThe Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.
Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
01/13/2025 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.
NASA’s Kennedy Marks New Chapter for Florida Space Industry
01/09/2025 | NASAThe future of research and technology at NASA’s Kennedy Space Center in Florida is expanding Wednesday, as Kennedy’s center director and charter members in the Florida University Space Research Consortium signed a memorandum of understanding in research and development to assist with missions and contribute to NASA’s Moon to Mars exploration approach.