The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Schmoll: Decades of Technology Evolution
It’s Only Common Sense: The Danger of Overthinking
SMTA Hosts Ultra High Density Interconnect Symposium
December 31, 2024 | SMTAEstimated reading time: Less than a minute
The Surface Mount Technology Association (SMTA) is pleased to announce the Ultra High Density Interconnect (UHDI) Symposium, taking place on Thursday, January 23 2025, at the Peoria Sports Complex in Peoria, Arizona.
Designed for industry leaders, researchers, engineers, designers, and academics, the UHDI Symposium fosters collaboration and knowledge sharing on the latest advancements and challenges in Ultra HDI technology.
Key Topics:
- PCB Design for Ultra HDI
- Fabrication Techniques for Ultra HDI
- Assembly Considerations for Ultra HDI
- Reliability Testing and Qualification for Ultra HDI
As the semiconductor industry pushes the boundaries of miniaturization and performance, the UHDI Symposium provides a platform to explore:
- Emerging trends and innovations in Ultra HDI technology
- Strategies for overcoming design, fabrication, assembly, and reliability challenges
- Accelerating the transition from prototype to high-mix, low-volume manufacturing
- Don't miss this opportunity to connect with industry experts, gain valuable insights, and shape the future of Ultra HDI technology.
For more information, visit https://smta.org/mpage/uhdi/.
Share on:
Suggested Items
Nano Dimension’s Essemtec Product Line Unveils FOX Ultra and PUMA Ultra, the Next Generation of High-Performance SMT Solutions
03/19/2025 | Nano DimensionNano Dimension Ltd., a supplier of Digital Manufacturing solutions, announced the launch of its latest high-performance solutions from its Essemtec product line: the FOX Ultra and PUMA Ultra.
Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance
03/05/2025 | Globe NewswireThis MoU marks a significant step forward for Tata Electronics, Himax, and PSMC in expanding their market outreach and jointly exploring the growing market of display semiconductors and ultralow power AI sensing in India as well as globally.
AIM to Highlight REL61™, W20, and Ultrafine Paste Offerings at Productronica China
02/19/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China, taking place March 26-28 at the Shanghai New International Expo Center.
Nordson Electronics Solutions Introduces ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station for Maintaining Conformal Coating Equipment
02/13/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces their latest technology innovation for conformal coating systems, the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station (patent pending) to keep nozzles and needles clean, and prevent clogging during production
UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
02/06/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in