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Advanced Electronics Packaging Digest

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Suggested Items

Marvell-Lumentum Deal to Challenge Broadcom’s Market Leadership

11/04/2026 | TrendForce
Marvell has officially announced its acquisition of optical communications giant Lumentum, with both companies’ boards approving the transaction on November 2. The deal remains subject to shareholder and regulatory approval across multiple jurisdictions.

Marvell-Lumentum Deal to Challenge Broadcom’s Market Lead

11/03/2026 | TrendForce
Marvell has officially announced its acquisition of optical communications giant Lumentum, with both companies’ boards approving the transaction on November 2. The deal remains subject to shareholder and regulatory approval across multiple jurisdictions.

Qnity Expands Thermal Management Solutions for AI Memory Cooling

10/13/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced two new advanced memory cooling solutions leveraging Laird™ Graphite-over-Foam (GOF) and Laird™ Thermal Interface Material (TIM) technologies.

DRAM Module Revenue Surges 59% in 2025 as Supply Constraints Drive Prices Higher

09/22/2026 | TrendForce
According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY.

Zhen Ding Technology Reports August 2026 Monthly Revenue

09/08/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history.
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