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Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update

03/18/2025 | Dennis Fritz -- Column: Defense Speak Interpreted
I’m Denny Fritz, the author of 30 “Defense Speak Interpreted” columns from 2018 to 2022. My original concept for this monthly op-ed was to explain the unique acronym language used by the U.S. Defense Department: CMMC, DIUx, C4ISR, JEDI, etc. When I started consulting for NSWV Crane almost 20 years ago, I would find myself sitting in meetings, perplexed at what I heard. Half the conversations were using acronyms that were foreign to me.

YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging

03/04/2025 | ACCESSWIRE
TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.

eInfochips Joins Samsung Advanced Foundry Ecosystem (SAFE™) to Drive Semiconductor Innovation

02/28/2025 | PRNewswire
eInfochips, an Arrow Electronics company, announced the company has joined the Samsung Advanced Foundry Ecosystem (SAFE™) as a Virtual Design Partner.

SEMI ISS Europe 2025 Speakers to Address AI, Sustainability, Supply Chain Resilience, and Workforce Development

02/17/2025 | SEMI
The SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, is themed AI: Catalyst to Propel Europe’s Competitiveness. The event will explore how AI is reshaping economic, technological, and market dynamics within the semiconductor industry.
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