Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Effects of Advanced Packaging and Stackup Design
December 26, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup.
Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Kris, tell us how advanced packaging can impact stackup design. What challenges do designers need to be aware of?
Kris Moyer: With advanced packaging you usually need to use HDI or UHDI technology. This usually means sequential lamination. With sequential lamination you need to select materials that can survive multiple lamination thermal cycles.
When we were discussing advanced packaging and stackup design recently, you said, “The rules we used to live by are no longer valid.” Expand on that a little bit.
As I mentioned, your selection of materials is now further restricted by the need for materials that survive multiple lamination cycles. Additionally, since we are adding layers one at a time and need plating on all layers, not just the outer layers, the copper design is now more difficult. Also, since we are adding layers one at a time, we can now have some select instances of unbalanced Z-axis and still meet bow and twist. Furthermore, many of the ultra-thin dielectric layers used in HDI/UHDI are just resin-coated copper without any reinforcement, so CTE/FA can be more of an issue.
To read this entire conversation, which appeared in the December 2024 issue of Design007 Magazine, click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Bending Circuits, Breaking Expectations: Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge brings together student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities. The Rise and Grind Crew were winners of the first round in the competition, and students Kevin Vo, Alexander (Alex) Wan, and Ethan Chung sat down with SMTA’s Tara Dunn to talk about the value of teamwork, AI integration in PCB design, and the satisfaction of seeing their hard work come to life.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
08/19/2025 | Happy Holden -- Column: Happy’s Tech TalkWith the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.