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Stop Inspecting AI and Start Understanding

10/20/2026 | Sean Patterson, CrossGen AI
If you are new to a PCB shop, there is a good chance your first real job is at the back end of the line. Maybe you run the AOI station or pull boards at final inspection and flag the ones that do not pass. I want you to notice something: Every board you reject has already been built. The copper was plated and the layers pressed before you ever saw it. Your job is to catch the mistake, not to stop it from happening. That is a problem, but not with you. Unfortunately, it has always been the way most shops go about achieving quality.

STMicroelectronics to Propose the Reappointment of Jean-Marc Chery as President & CEO

10/19/2026 | STMicroelectronics
STMicroelectronics announced that its Supervisory Board has asked Jean-Marc Chery, ST’s President and CEO, to be available for a reappointment in his current role for an additional year. Jean-Marc Chery has accepted the proposal.

ExpressPCB Plus 3.4 Checks the Whole Board Before You Order

10/19/2026 | ASC Sunstone Circuits
Free update adds full-board design rule checking, restores SnapMagic part downloads, and brings ExpressPCB Classic designs into the new DR

From Legacy to Next-Generation PCBAs: Zero-Defect Testing in Aerospace and Defense Electronics

10/13/2026 | Francesca Pinto, SPEA
In the aerospace and defense industry, a PCB assembly is never just a collection of components soldered onto a substrate. It is a working part of a much larger mission system responsible for flight control, navigation, communication, power distribution, surveillance, or targeting. Whether it sits inside a civil aircraft, an autonomous drone, a compact satellite, an advanced radar unit, or a military ground vehicle, that assembly is expected to perform without fail throughout its service life, often measured in decades.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.
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