It’s Only Common Sense: You Can’t Please Everyone—Focus on the Right Customers
Marcy’s Musings: Fueling the Workforce Pipeline
The Chemical Connection: Better Fabs Attract a Better Workforce
IPC Releases Latest List of Standards and Revisions
December 17, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to the IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
IPC-6904
Qualification and Performance Specification for Printed Electronics on Rigid Substrates
IPC-6904 establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive.
IPC/Hermes-9852-v1.6
The Global Standards for Machine-to-Machine Communication in SMT Assembly
IPC-Hermes-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface mount technology. Used with IPC-2591, Connected Factory Exchange, IPC-Hermes-9852 can assist any electronics manufacturer, large or small, to align their companies with Smart manufacturing and Industry 4.0. Version 1.6 includes updates to SendBoardInfo and capabilities for Hermes-enabled equipment to be queried on its Hermes capabilities.
To see the rest of the standards released for Q4, which were featured in the Fall 2024 issue of IPC Community, click here.
Share on:
Suggested Items
Amphenol Announces Q1 2025 Dividend
01/30/2025 | Amphenol CorporationAmphenol Corporation announced that its Board of Directors approved the first quarter 2025 dividend on its Common Stock in the amount of $0.165 per share at its meeting held on January 29, 2025.
Keysight, KD Partner to Advance Multigigabit Optical Automotive Ethernet Testing with New Signal Analysis Capability
01/30/2025 | Keysight TechnologiesKeysight Technologies, Inc. and KD, Inc., a fabless semiconductor company, have collaborated to create a comprehensive test for Multigigabit Optical Automotive Ethernet physical layer.
China’s Smartphone Market Rebounds with 5.6% Growth in 2024, Fueled by vivo and Huawei
01/30/2025 | IDCAccording to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker, China's smartphone market shipped 76.4 million units in 4Q24, a 3.9% year-on-year (YoY) increase.
Rising AI Infrastructure Demand Highlights Industry Shift Toward Cost-Effective Solutions as DeepSeek Gains Traction
01/30/2025 | TrendForceTrendForce’s latest investigations have revealed that the recent release of DeepSeek-V3 and DeepSeek-R1 underscores an industry-wide shift toward more cost-effective AI infrastructure.
Istvan Novak Looks Back on History of DesignCon
01/29/2025 | Andy Shaughnessy, Design007 MagazineMany of us have been attending DesignCon for a long time, but Samtec’s Istvan Novak has been attending DesignCon even before it was called DesignCon. A veteran signal and power integrity engineer, Istvan has been on the Technical Program Committee for over two decades, and he’s authored and co-authored a variety of award-winning conference papers. In honor of the show’s 30th anniversary, I asked Istvan to share a little about the early years of DesignCon, and how he got involved with the event.