SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
December 11, 2024 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
The final incentives, part of the CHIPS and Science Act, solidify support for Micron’s memory chip production facilities in Idaho and New York. Additionally, the Commerce Department announced $275 million in preliminary incentives to expand Micron’s manufacturing facility in Manassas, Virginia, further accelerating semiconductor manufacturing capabilities in the U.S.
“These critical incentives underscore the transformative impact of the CHIPS and Science Act in driving domestic semiconductor production and innovation to ultimately enhance supply chain resilience and American competitiveness,” said Neuffer. “Memory is a technology critical to America’s economic future and national security, and Micron’s historic investments in producing memory chips in the U.S. will strengthen U.S. leadership for the long term. We commend Micron for its forward-looking investments in Idaho, New York, and Virginia, and we applaud the Department of Commerce for its steadfast commitment to strengthening America’s leadership in chip manufacturing. Together, these efforts will create high-paying American jobs, bolster U.S. national and economic security, and fuel innovation for years to come.”
The CHIPS Act has spurred significant investments across the domestic semiconductor industry, with more than 90 new projects announced in 28 U.S. states since its introduction, totaling hundreds of billions in private investments. These projects are expected to generate over 58,000 jobs directly within the semiconductor ecosystem and support hundreds of thousands of additional jobs throughout the U.S. economy.
The finalized incentives for Idaho and New York build upon a preliminary agreement announced in April 2024, while the new agreement for the Manassas expansion represents a pivotal step in advancing U.S. semiconductor manufacturing capacity.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend
05/08/2026 | GlobalFoundriesAt its 2026 Investor Day, GlobalFoundries highlighted clear opportunities for durable growth in AI-centric markets, expanding profitability and long-term value creation, underpinned by its broadening technology roadmap for the scaling of AI data centers and the proliferation of AI into the physical world, served from its unique, resilient global manufacturing footprint.
SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem
05/06/2026 | SEMIGlobal experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.
Sharp Increase in Global Semiconductor Sales in Q1 2026
05/05/2026 | ESIAThe European Semiconductor Industry Association (ESIA) reports that, in the first quarter of 2026, the global semiconductor market recorded a sharp increase of 79.2% year-on-year, reaching USD 298.55 billion in sales.
Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware
05/05/2026 | PRNewswireXanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.