-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Global Total Semiconductor Equipment Sales Forecast to Reach a Record of $139 Billion in 2026
December 9, 2024 | SEMIEstimated reading time: 3 minutes
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching $113 billion in 2024, growing 6.5% year-on-year, SEMI announced in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON Japan 2024. Semiconductor manufacturing equipment growth is expected to continue in the following years, reaching new records of $121 billion in 2025 and $139 billion in 2026, supported by both the front-end and back-end segments.
“Three consecutive years of projected growth in investments in semiconductor manufacturing reflect the vital role our industry plays in underpinning the global economy and advancing technology innovation,” said Ajit Manocha, SEMI president and CEO. “Since our July 2024 forecast, the outlook for 2024 semiconductor equipment sales has brightened, especially with stronger-than-expected investments from China and in AI-related sectors. Together with our forecast extension through 2026, it highlights the robust growth drivers across segments, applications, and regions.”
Semiconductor Equipment Sales by Segment
After registering a record $96 billion in sales last year, the wafer fab equipment (WFE) segment, which includes wafer processing, mask/reticle, and fab facilities equipment, is projected to grow 5.4% to $101 billion in 2024. This marks an increase from the previously forecast $98 billion in SEMI’s 2024 Mid-Year Equipment Forecast. The upward revision mainly reflects the ongoing strong equipment investments in DRAM and high-bandwidth memory (HBM) driven by artificial intelligence (AI) computing. Additionally, China’s investments continue to play a significant role in the WFE market expansion. Looking ahead, WFE segment sales are projected to expand 6.8% in 2025 and 14% in 2026, reaching $123 billion due to increased demand for advanced logic and memory applications.
Following two years of contraction, the back-end equipment segment in 2024 saw a strong recovery in particular in the second half of the year. Sales of semiconductor test equipment are projected to rise 13.8% to $7.1 billion in 2024, while assembly and packaging (A&P) equipment sales are projected to increase 22.6% to $4.9 billion. Furthermore, the back-end segment growth is expected to accelerate, with test equipment sales surging 14.7% in 2025 and 18.6% in 2026, respectively, while A&P sales are forecast to grow 16% in 2025 followed by 23.5% expansion in 2026. The back-end segments’ growth is supported by the increasing complexity of semiconductor devices for high-performance computing and the expected increase in demand in the mobile, automotive, and industrial end-markets.
Wafer Fab Equipment Sales by Application
The sales of WFE for foundry and logic applications are expected to remain flat year-on-year at $58.6 billion in 2024, supported by resilient spending in mature nodes. The segment is forecast to see 2.8% growth in 2025 and to increase 15% to $69.3 billion in 2026, driven by increasing demand for leading-edge technology, the introduction of new device architectures including the transition to gate-all-around (GAA), and increased capacity expansion purchases.
Memory-related capital expenditures are projected to see significant increases through 2026 supported by increasing demand for HBM for AI deployment and ongoing technology migration. NAND equipment sales are expected to remain relatively soft in 2024, growing 0.7% to $9.3 billion as supply and demand continues to normalize, setting the stage for a 47.8% expansion to $13.7 billion in 2025 and 9.7% growth to $15.1 billion in 2026. Meanwhile, DRAM equipment sales are projected to see robust growth of 35.3% to $18.8 billion in 2024, followed by 10.4% and 6.2% year-on-year growth in 2025 and 2026, respectively.
Semiconductor Equipment Sales by Region
China, Taiwan and Korea are expected to remain the top three destinations for equipment spending through 2026. China is projected to maintain the top position over the forecast period as the region’s equipment purchases continue to remain resilient despite the anticipated slowdown. Equipment shipments to China are projected to reach a record $49 billion in 2024, solidifying its lead over other regions. While equipment spending for most regions is expected to fall in 2024 before rebounding in 2025, China is expected to see a contraction in 2025 following significant investments over the past three years. All regions tracked are expected to see increases in 2026.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.