NEOTech Significantly Improves Wire Bond Pull Test Process
November 25, 2024 | NEOTechEstimated reading time: 1 minute

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%. This improvement reflects NEOTech’s commitment to continuous process enhancement and operational excellence.
The wire bond pull test is a critical method used to assess the quality and integrity of wire bonds in microelectronics. Leveraging extensive historical data and its exceptional process yield rate, NEOTech’s manufacturing engineers developed a robust random sampling methodology that ensures testing efficiency without compromising quality. The new sampling plan has dramatically reduced average testing time from 2.5 hours per assembly to approximately 1 hour per assembly.
This innovative process is fully compliant with the stringent requirements of MIL-PRF-38534 and MIL-STD-883, ensuring that NEOTech meets the highest quality and reliability standards. The process has been implemented on mission-critical, high-frequency RF assemblies — products recognized in the industry as highly complex and challenging to manufacture. NEOTech’s success in achieving these advancements demonstrates its expertise in addressing the rigorous demands of such sophisticated microelectronics applications.
“Achieving greater than 99.99% production yields is a remarkable milestone,” said Daniel De Haro, General Manager of the NEOTech Chatsworth site. “But our team didn’t stop there. They went above and beyond to implement innovative sampling techniques and streamline testing processes to significantly improve production cycle times. I’m incredibly proud of our engineers, technicians, and manufacturing teams for their dedication to excellence and their commitment to setting new benchmarks in microelectronics manufacturing.”
The transition to a sample-based testing methodology was supported by enhanced data collection and analysis, as well as the development of comprehensive training procedures. These efforts ensured that the NEOTech team could maintain its exceptional yield rates while increasing throughput and efficiency for its customers’ microelectronics circuit assemblies.
At the core of NEOTech’s success is its customer-centric approach. Offering a comprehensive suite of services — from design and prototyping to full-scale production and post-production support — NEOTech tailors its solutions to meet each customer’s specific needs. The company’s ability to provide personalized solutions, while also reducing time-to-market and optimizing costs, has earned it a strong reputation for delivering exceptional value.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
TSMC and South Korean Rivals Lose U.S. Fast-Track Export Privileges for China
09/03/2025 | I-Connect007 Editorial TeamWashington has revoked Taiwan Semiconductor Manufacturing Co.’s (TSMC) special fast-track status for U.S. chip-making equipment exports to its Nanjing, China, plant, Reuters reported on Sept. 2. The move comes days after similar actions against South Korean chip makers Samsung Electronics and SK Hynix.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
It's Only Common Sense: Leveraging AI in Your Sales Strategy
09/01/2025 | Dan Beaulieu -- Column: It's Only Common SenseLet’s get one thing straight: AI isn’t here to replace you; it’s here to make you smarter and faster. Every time a new tool shows up, half the sales floor panics: “They’re going to automate us out of a job!” This is shouted while doomscrolling LinkedIn. Relax. Sales is still, and will always be, about human connection, trust, and delivering value. However, if you’re not using AI to your advantage, you’re handing your competitors a loaded gun and asking them to shoot first.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."