Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Advanced Packaging: Preparation is Now
November 20, 2024 | Nolan Johnson, SMT007 MagazineEstimated reading time: 2 minutes
A new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Nolan Johnson: Your white paper on advanced packaging is a very technically deep, insightful piece with great detail. What's the ultimate goal?
Matt Kelly: Our intent was to go one layer deeper into our silicon-to-systems messaging. You've heard this phrase as a way to describe what's happening at the front end of the supply chain, from chips to the final system. The report begins by talking about applications. It's important to understand that advanced packaging is very broad, so we break down what it means to drive market segments.
For example, advanced packaging means different things in different applications, such as high-performance computing (HPC), 5G/6G wireless communications, autonomous driving and EV automotive, medical electronics, and aerospace and defense systems. Depending on the type of environment and product you're dealing with, the challenges, needs, and requirements for what these advanced packaging techniques can deliver will vary.
This report is important because it combines two concepts—component-level packaging (CLP) and system-level packaging (SLP)—which are obviously related.
It’s important to convey that the amount of time, effort, and investment IPC has made to stay on top of changes with advanced packaging will be ongoing and is here to stay. A long time ago, someone taught me that “everything follows silicon”; just watch what it does, and everything else will follow. That lesson holds true here, too. People are already doing a lot of this work. Products and devices are using this technology as we speak. This is not “someday”; it's actually happening now. But as with everything else, there's breadth to this for the entities unaware of these challenges. We know it’s important for our membership and the industry that we stay on top of this.
To read the continue reading this article, which originally appeared in the November 2024 SMT007 Magazine, click here.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Coastal RF Systems Joins StratEdge’s Network as Manufacturer’s Representative for Southern California
10/31/2024 | StratEdgeStratEdge Corporation, a leader in high-performance semiconductor packaging solutions, has appointed Coastal RF Systems as its exclusive Manufacturer's Representative for Southern California.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
10/22/2024 | StratEdgeStratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).