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U.S. Army Awards Lockheed Martin Contract to Increase PAC-3 MSE Production Capacity
November 14, 2024 | Lockheed MartinEstimated reading time: 1 minute
The U.S. Army recently awarded Lockheed Martin a contract to support increasing production capacity to 650 Patriot Advanced Capability – 3 (PAC-3®) Missile Segment Enhancements (MSEs)per year. This is a vital step in significant efforts to meet the global demand for the world’s most advanced missile.
“Demand for PAC-3 MSE’s combat-proven deterrence capabilities continues to grow at a rapid pace,” said Brian Kubik, vice president of PAC-3 Programs at Lockheed Martin Missiles and Fire Control. “To meet the increased demand, Lockheed Martin started this effort with internal funding more than a year ago to expand the PAC-3 MSE production capacity, both in our factories and across the supply chain. We are also investing to implement lean, agile processes to deliver this critical product to our partners more efficiently.”
Over the last eight months, the PAC-3 team has significantly increased output and achieved new record highs for missile production. In 2024, production has grown by more than 30% with another 20% growth planned for next year.
Lockheed Martin is on track to produce in excess of stated capacity for the next several years.By the end of 2024, Lockheed Martin will have exceeded 500 PAC-3 MSEs, a new production high. The team also recently completed the 2,000th PAC-3 MSE missile– a significant milestone in the life of the program.
The production ramp up of critical systems like PAC-3 is a key component of Lockheed Martin’s 21st Century Security® vision which aims to strengthen the defense industrial base and develop more advanced, modernized solutions. As Lockheed Martin continues to ramp up production to meet demand, PAC-3 MSE remains at the forefront, addressing both current and emerging threats with unwavering precision and effectiveness.
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Sweeney Ng - CEE PCBSuggested Items
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Ibiden Opens Ono Plant to Expand AI Server IC Substrate Production Capacity
10/14/2025 | IBIDENIBIDEN Co., Ltd. announces that it held the opening ceremony for its Ono Plant on October 10, 2025 in Ono Town, Ibi District, Gifu Prefecture. Construction work and preparations for mass production at the plant had been underway.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.