Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Your AI Doesn't Know Your Process (Here's How to Teach It)

08/13/2026 | Sean Patterson, CrossGen AI
Last month, I made the case that you should not buy AI in the hope that it will fix the business. You need to learn it yourself first. If your AI is failing, it’s not because it is lazy or broken. It is failing because it does not know your plant. It does not know your quoting rules, how material gets released to the floor, what your customer expects in an 8D1, or which spec outranks another. It certainly does not know where your team hides the real answer once the formal procedure and reality have drifted apart.

USMCA Rules of Origin for Electronics: What Could Change in 2026

08/05/2026 | James Kim, Arentfox Schiff LLP
In my first article on the USMCA, I explained why the USMCA six-year review matters to the electronics industry and where the negotiations currently stand. Now I want to get under the hood, because the most consequential changes for electronics manufacturers are in the rules of origin, the technical framework that determines whether your product gets duty-free treatment under USMCA. Free trade agreements don't just lower tariffs; they also determine what counts as an “originating” product.

Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional

05/06/2026 | Michael Carano -- Column: Trouble in Your Tank
There is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.

Automating the Repeatable Parts of Hardware Design

03/12/2026 | Kyle Dumont, AllSpice.io
Despite working on some of the most sophisticated technology in the world, many hardware engineers still rely on spreadsheets, tribal knowledge, and sometimes, quite literally, pen, paper, and a highlighter. Delivering new hardware products on schedule often comes down to finding a needle in a haystack disguised as a 900-page specification or datasheet. AllSpice.io set out to automate the repeatable parts of hardware design: the well-defined, rules-based tasks that make sure nothing gets missed and everything lines up.

The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics

12/02/2025 | Chris Mitchell -- Column: The Government Circuit
As the 2026 review of the U.S.-Mexico-Canada Agreement (USMCA) approaches, policymakers have a rare opportunity to reinforce a partnership that powers their shared competitiveness, resilience, and growth. That is the message that I will have the honor of delivering on behalf of the Global Electronics Association in a public hearing at the U.S. International Trade Commission in Washington on Dec. 4. We’ve also submitted our views formally to the U.S. Trade Representative, and we’ve shared our position far and wide.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in